Reliability of Ag bonding wires and its coated variants from the perspective of IMC degradation and its correlation to wire and epoxy molding compound material properties under corrosive environment

Flauta, Randolph; Garete, April Joy; Farrugia, Mark Luke; Sekaran, Sreetharan; Chen, Haibin

doi:10.1109/ectc51906.2022.00326

Cited by 2 publications

(1 citation statement)

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“…Some researchers have adopted the form of gold plating or alloy to reduce the cost or obtain better performance. [ 5,6 ] Gold wires are bonded to aluminum pads, and thin Au–Al compounds are usually observed on the aluminum pads. (It is also shown in the literature that similar metallic compounds will also be produced in the experimental operation of bonding Al wires on Au pads.…”

Section: Introductionmentioning

confidence: 99%

Calculation of Mechanical Properties, Electronic Properties, and Thermodynamic Properties of AuAl Crystal: First‐Principles Calculation

Han

Liu

Zhou

2023

Cryst. Res. Technol.

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The structural stability, elastic properties, electronic properties, and thermodynamic property (Debye temperature) of AuAl intermetallic compound (IMC) are systematically investigated using first‐principles calculations based on density functional theory. The elastic constants, elastic moduli (including bulk modulus, shear modulus, Young's modulus, and Poisson's ratio) and Vickers hardness, the density of states, and Debye temperature of AuAl under hydrostatic pressure are calculated. The calculation results show that AuAl is an elastic anisotropic material with low rigidity and high toughness under zero pressure. Under hydrostatic pressure, the anisotropy index decreases while the hardness and Debye temperature increase. The research in this paper provides a theoretical basis for the study of the properties of bonding gold wire intermetallics.

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Section: Introductionmentioning

confidence: 99%