Reliability of 3D additive manufactured packages

Lungen, Sebastian; Tiedje, Tobias; Meier, Karsten; Nieweglowski, Krzysztof; Bock, Karlheinz

doi:10.1109/estc.2018.8546417

Cited by 8 publications

(2 citation statements)

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“…3D printing of highly pure copper with superior electrical and thermal properties has been studied extensively due to its broad potential in many applications including electronic devices [1,[12][13][14][15][16][17][18][19][20], thermal management systems [4,12], and the aerospace industry [4,12,[21][22][23][24][25]. Compared to conventional 3D printing of highly pure copper with superior electrical and thermal properties has been studied extensively due to its broad potential in many applications including electronic devices [1,[12][13][14][15][16][17][18][19][20], thermal management systems [4,12], and the aerospace industry [4,12,[21][22][23][24][25]. Compared to conventional fabrication methods such as metal casting, welding, and machining, 3D printing can fabricate more optimized and complex 3D copper parts without using additional tools [26][27][28][29][30][31]…”

Section: Introductionmentioning

confidence: 99%

3D Printing of Highly Pure Copper

Tran

Chinnappan

Lee

et al. 2019

Metals

158

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Copper has been widely used in many applications due to its outstanding properties such as malleability, high corrosion resistance, and excellent electrical and thermal conductivities. While 3D printing can offer many advantages from layer-by-layer fabrication, the 3D printing of highly pure copper is still challenging due to the thermal issues caused by copper’s high conductivity. This paper presents a comprehensive review of recent work on 3D printing technology of highly pure copper over the past few years. The advantages and current issues of 3D printing methods are compared while different properties of copper parts printed by these methods are summarized. Finally, we provide several potential applications of the 3D printed copper parts and an overview of current developments that could lead to new improvements in this advanced manufacturing field.

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Section: Introductionmentioning

confidence: 99%

3D Printing of Highly Pure Copper

Tran

Chinnappan

Lee

et al. 2019

Metals

158

View full text Add to dashboard Cite

show abstract

“…1b). Some similar methodologic explorations [26,27] have used this direct bonding method to evaluate whether low-cost 3D-printed packaging could replace the fan-out wafer-level packages. However, the high-CTE resin used thus far (87.5 ppm/ • C) does not yet suit applications with many and high-temperature cycles.…”

Section: Introductionmentioning

confidence: 99%