Reliability issues of e-Cubes heterogeneous system integration

Janczyk, Grzegorz; Bieniek, T.; Szynka, J.; Grabiec, P.

doi:10.1016/j.microrel.2008.06.023

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Multi-domain Modeling and Simulation Examples1

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“…While in the high power mode the maximum displacement reaches 24 µm on the edge of the structure, in the low power mode the displacement does not exceed 6 µm. The heterogeneous device oriented (Hedoris) multi-domain simulation system [10], [11] will be developed within the framework of the projects mentioned above. The Hedoris system implements the idea of the hardware description language (HDL) of the device model based on Verilog-AMS [12] language specification used for device thermal modeling.…”

Section: Multi-domain Modeling and Simulation Examplesmentioning

confidence: 99%