2014 International Conference on Electronics Packaging (ICEP) 2014
DOI: 10.1109/icep.2014.6826732
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Reliability improvements in electronic systems by combining condition monitoring approaches

Abstract: This paper gives an overview of different methods of condition monitoring (parameter measurement, canary principle, life cycle unit). It describes the advantage of combining the condition monitoring (CM) methods to improve the reliability of electronic systems. A workflow to implement CM methods is described as well as different system levels and the associated applicable CM method. The paper concludes with the example of an electronic system and a concept to monitor the whole system by means of all three CM m… Show more

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