Reliability characterization of the SLICC package

Lall, Pradeep; Gold, Gerald; Miles, B.M.; Banerji, K.; Thompson, Patrick; Koehler, C.; Adhihetty, I.S.

doi:10.1109/ectc.1996.550888

Cited by 9 publications

(7 citation statements)

References 3 publications

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“…2,3 Lall et al conducted the threepoint bending test on CSP with varying substrate thickness. 4 The registered force-displacement curves demonstrated that a package with a thicker substrate had higher bending modulus. In addition, the force-displacement curves could also be used to indicate crack initiation and characterize the physical phenomena for crack propagation.…”

Section: Influences Of Materials Source Wafer Process and Location Onmentioning

confidence: 94%

Influences of Material Source, Wafer Process and Location on Silicon Die Fracture Strength

Liu

Shih

et al. 2002

Experimental Techniques

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Section: Influences Of Materials Source Wafer Process and Location Onmentioning

confidence: 94%

Influences of Material Source, Wafer Process and Location on Silicon Die Fracture Strength

Liu

Shih

et al. 2002

Experimental Techniques

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“…In their studies, Yasunaga et al [7], [8] and Lall et al [9] adopted elasto-plastic constitutive relation for solder joints of CSP assemblies. Lau et al [10] used elastoplastic-creep constitutive relation for the solder joint.…”

Section: Introductionmentioning

confidence: 98%

“…For the thermal fatigue life prediction, Yasunaga et al [7] showed that, based on the Coffin-Manson's law, the thermal fatigue life could be evaluated by using the plastic shear strain range. Based on values of the plastic work (a combination of stress and strains), Lall et al [9] predicted that it would take around 655 cycles and 3930 cycles to initiate the crack at the primary region and the secondary region, respectively. These locations refer to two high stress concentration areas in the solder joint.…”

Section: Introductionmentioning

confidence: 99%

Computational parametric analyzes on the solder joint reliability of bottom leaded plastic (BLP) package

Zhang

Lee

Choi

et al. 2002

IEEE Trans. Adv. Packag.

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The bottom-leaded plastic (BLP) package is a lead-on-chip type of chip scale package (CSP) developed mainly for the memory device. Because the BLP package is one of the smallest plastic packages available, solder joint reliability becomes a critical issue. In this study, a 28-pin BLP package is modeled to investigate the effects of molding compound and leadframe material properties, the thickness of printed circuit board (PCB), the shape of solder joint and the solder pad size on the board level solder joint reliability. A viscoplastic constitutive relation is adopted for the modeling of solder in order to account for its time and temperature dependence on thermal cycling. A three-dimensional nonlinear finite element analysis based on the above constitutive relation is conducted to model the response of a BLP assembly subjected to thermal cycling. The fatigue life of solder joint is estimated by the modified Coffin-Manson equation. The two coefficients in the modified Coffin-Manson equation are also determined. Parametric studies are performed to investigate the dependence of solder joint fatigue life on various design factors. Index Terms-BLP, CSP, finite element analysis, solder joint reliability, viscoplastic.

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“…Therefore, there are two opposing factors that must be balanced to optimize a board design. Board stiffness is a dominant factor for determining BGA failures from out of plane deformation (Lall et al , 1996; Lau and Pao, 1997). We have characterized an “offset‐bend” testing method, which allowed bend testing of thin flexible boards with stiff components, rather than thick boards which are more often used for bend testing evaluations of new packaging technology and assembly processes.…”

Section: Introductionmentioning

confidence: 99%

Materials characterization of the effect of mechanical bending on area array package interconnects

Rooney

Castello

Cibulsky

et al. 2003

Microelectronics International

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The mechanical integrity of solder joint interconnects in PWB assemblies with micro ‐ BGA, chip scale, and LGA packages are being questioned as the size and pitch decrease. Three‐point cyclic bend testing provides a useful tool for characterizing the expected mechanical cycling fatigue reliability of PWB assemblies. Cyclic bend testing is useful for characterizing bending issues in electronic assemblies such as repetitive keypad actuation in cell phone products. This paper presents the results of three‐point bend testing of PWB assemblies with fine pitch packages. The methodology of materials analyses of the metallurgy of solder interconnects following mechanical bending and thermal cycle testing is described.

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Reliability characterization of the SLICC package

Cited by 9 publications

References 3 publications

Influences of Material Source, Wafer Process and Location on Silicon Die Fracture Strength

Influences of Material Source, Wafer Process and Location on Silicon Die Fracture Strength

Computational parametric analyzes on the solder joint reliability of bottom leaded plastic (BLP) package

Materials characterization of the effect of mechanical bending on area array package interconnects

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