Reliability analysis of a novel fan‐out type WLP

Yew, Ming-Chih; Tsai, Mars; Hu, Dyi-Chung; Yang, Wenyu; Chiang, Kuo‐Ning

doi:10.1108/09540910910970394

Cited by 9 publications

(6 citation statements)

References 21 publications

(23 reference statements)

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“…However, the Weibull analysis may underestimate or overestimate the reliability and the mean life to failure significantly. Such underestimation or overestimation of the solder joint reliability by Weibull distributions can be found in many previous works (Tapani Nurmi and Olavi Ristolainen (2002), Kang et al (2004); Suhling et al (2004), Arulvanan et al (2006); Yew et al (2009), Herkommer et al (2010); Collins et al (2012), Arfaei et al (2013); Libot et al (2018)).…”

Section: Introductionmentioning

confidence: 55%

Machine learning framework for predicting reliability of solder joints

Jones

2019

SSMT

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Purpose This paper aims to present a machine learning framework for using big data analytics to predict the reliability of solder joints. The purpose of this study is to accurately predict the reliability of solder joints by using big data analytics. Design/methodology/approach A machine learning framework for using big data analytics is proposed to predict the reliability of solder joints accurately. Findings A machine learning framework for predicting the life of solder joints accurately has been developed in this study. To validate its accuracy and efficiency, it is applied to predict the long-term reliability of lead-free Sn96.5Ag3.0Cu0.5 (SAC305) for three commonly used surface finishes such OSP, ENIG and IAg. The obtained results show that the predicted failure based on the machine learning method is much more accurate than the Weibull method. In addition, solder ball/bump joint failure modes are identified based on various solder joint failures reported in the literature. Originality/value The ability to predict thermal fatigue life accurately is extremely valuable to the industry because it saves time and cost for product development and optimization.

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Section: Introductionmentioning

confidence: 55%

Machine learning framework for predicting reliability of solder joints

Jones

2019

SSMT

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“…The simulation procedure and the suitable mesh density for the solder joints has been validated through traditional WLP and thermal cycling tests. In addition, the thickness and width of the trace lines are 15 μm and 40 μm, respectively, and the mesh density refers to previous research, which has validated the trace line with a thermal cycling test [9]. A 96.5Sn/3.5Ag lead-free solder is used in the proposed structure, and the related material properties are shown in Table 2.…”

Section: Finite Element Modeling Of Double-sided With Double-chip Stamentioning

confidence: 99%

“…(3). In addition, S u /E, computed as 1.731 × 10 -3 , is obtained through the standard tensile test of copper, and the fatigue ductility (D f ) used in Engelmaier model is 0.172, as determined by Yew [20]. The predicted fatigue life of trace layer is 2,819 cycles.…”

Section: Reliability Assessment and Failure Mechanismmentioning

confidence: 99%

“…The reliability characteristic was described using finite element (FE) analysis, and it was concluded that a thinner chip, superior trace scheme, and application of a suitable stress buffer layer could decrease the stress/strain value in the redistribution layer (RDL). The same team also proposed a panel base package (PBP) technology with fan-out capability to expand the fine pitch input/output (I/O) of chips using the RDLs on the applied soft filler material [9]. The FE analysis showed that the reliability of solder joints was enhanced by soft lamination materials and filler polymers.…”

Section: Introductionmentioning

confidence: 99%

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Design and Reliability Assessment of Novel 3D-IC Packaging

Chiang

Liang

2016

J. mech.

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Presently, physical limitations are restricting the development of the microelectronic industry driven by Moore's law. To achieve high-performance, small form factor, and lightweight applications, new electronic packaging methods have exceeded Moore's law. This research proposes a double-chip stacking structure in an embedded fan-out wafer-level packaging with double-sided interconnections. The overall reliability of the solder joints and redistributed lines is assessed through finite element analysis. The application of soft lamination material and selection of a carrier material whose coefficient of thermal expansion (CTE) is close to that of the printed circuit board can effectively enhance the reliability of solder joints over more than 1,000 cycles. A trace/pad junction whose direction is parallel to the major direction of the CTE mismatch is recommended, and the curved portion of trace lines can absorb the expansion of metal lines and filler material. Design-on-simulation methodology is necessary to develop novel packaging structures in the electronic packaging industry.

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“…In order to reduce calculation time and increase the research efficiency, the global-local modeling approaches now are widely used, such as specific boundary constraints (SBC) method [4][5] and multi-point constraints (MPC) method [6][7][8]. Therefore, in this research MPC method is used to simulate and direct-field coupling thermal-structural FE analysis were conducted to analyze the temperature distribution of IGBT and the mechanical behaviors of bonding wire under cyclic power cycling test.…”

Section: Introductionmentioning

confidence: 99%

Thermal analysis and reliability assessment of power module under power cycling test using global- local finite element method

Chiang

Hsu

et al. 2014

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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Insulated gate bipolar transistor (IGBT) power modules have acquired fast switching and low conduction loss characteristics. Because of these electrical characteristics, the IGBT has been widely applied in power supplies, e.g. hybrid electric vehicle, wind power generation, etc. However, the IGBT during rapid transient operation under high power can cause the IGBT chip to lead high junction temperature and high temperature gradients. Furthermore, because of the coefficient of thermal expansion (CTE) mismatch between the various material layers, the bonding wires and the solder joints are subjected to thermo-mechanical stress which cause solder fatigue and bonding wire failure, and then affect the reliability of IGBT under actual operation conditions. A 3-D finite element (FE) model was established base on real test samples. The simulation results found that the maximum junction temperature 112.5 is observed at the middle of IGBT chip under the load current of 40 A. Then analyze the mechanical behaviors of IGBT, the structural simulation results show that under a cyclic power environment, the stress concentration within the wire, caused by the CTE mismatch between the wire and the IGBT chip. Therefore, the wire/chip interface is the weaker portion of the power module. Finally, according to the life prediction models of literatures, this paper assessed the reliability of bonding wire in order to investigate the effects of thermal stress and strain on reliability during power cycling test.

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Reliability analysis of a novel fan‐out type WLP

Cited by 9 publications

References 21 publications

Machine learning framework for predicting reliability of solder joints

Machine learning framework for predicting reliability of solder joints

Design and Reliability Assessment of Novel 3D-IC Packaging

Thermal analysis and reliability assessment of power module under power cycling test using global- local finite element method

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