Reliability analysis for competing failure processes with mutual dependence of the system under the cumulative shock

Bian, Lina; Wang, Guanjun

doi:10.1109/aparm49247.2020.9209572

Cited by 3 publications

(6 citation statements)

References 21 publications

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“…The term “competitive failure” describes both the hard failures that result from external random shocks and the soft failures caused by the gradual degradation process that is affected by ambient temperature. These failures are interdependent [ 94 ]. Each unforeseen disturbance results in an additional abrupt escalation in the system's degradation, while the overall degradation lowers the threshold for hard failure [ 95 ].…”

Section: Mems Reliability With Consideration Of Temperaturementioning

confidence: 99%

Reliability of MEMS inertial devices in mechanical and thermal environments: A review

Xu,

Liu,

et al. 2024

Heliyon

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Section: Mems Reliability With Consideration Of Temperaturementioning

confidence: 99%

Reliability of MEMS inertial devices in mechanical and thermal environments: A review

Xu,

Liu,

et al. 2024

Heliyon

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“…For better modeling of the degradation process, a linear degradation path is applied, which can be expressed as: 𝑋(𝑡) = 𝜑 + 𝛽𝑡. 25 Where, the constant 𝜑 represents the initial degradation, 𝛽 is the degradation rate. The constant 𝜑 and 𝛽 follow normal distribution, that is, 𝛽 ∼ 𝑁(𝜇 𝛽 , 𝜎 2 𝛽 ).…”

Section: Soft Failure Analysis and Modeling Subject To Random Shockmentioning

confidence: 99%

“…According to the above analysis, the arrival time of the jth shock is denoted as 𝑇 𝑗 , and the expression for the total degradation can be obtained as 25 :…”

Section: Soft Failure Analysis and Modeling Subject To Random Shockmentioning

confidence: 99%

“…Soft failure occurs when the total degradation

{X}_S( t )

, including the continuous degradation

X( t )

and the accumulated degradation

S(t)

due to random shocks, exceeds a threshold level H . For better modeling of the degradation process, a linear degradation path is applied, which can be expressed as:

X(t) = \varphi + \beta t

25 . Where, the constant φ represents the initial degradation, β is the degradation rate.…”

Section: Reliability Modeling Considering Dependent Competing Failure...mentioning

confidence: 99%

“…According to the above analysis, the arrival time of the j th shock is denoted as

{T}_j

, and the expression for the total degradation can be obtained as 25 :

\begin{equation} {X}_S(t) = X(t) + S(t) = \left\{ { \def\eqcellsep{&}\begin{array}{ll} {\varphi + {\beta }_1{T}_j + {\beta }_2\left( {t - {T}_j} \right) + \displaystyle\sum_{i = 1}^{N(t)} {{Y}_i} ,}&{j \le N(t)}\\[12pt] {\varphi + {\beta }_1t + \displaystyle\sum_{i = 1}^{N(t)} {{Y}_i} ,}&{j &gt; N(t)} \end{array} } \right..\end{equation}

…”

Section: Reliability Modeling Considering Dependent Competing Failure...mentioning

confidence: 99%

See 2 more Smart Citations

Reliability modeling of dependent competing failure processes based on time‐dependent threshold level δ and degradation rate changes

Lyu

et al. 2023

Quality & Reliability Eng

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A new reliability model for dependent competing failure processes is proposed. The reliability model uses the generalized Polya process (GPP) to model the arrival of shocks and considers the degradation rate change. Most systems fail due to performance degradation and external environment shocks. On the one hand, soft failure occurs when the total amount of degradation, including continuous degradation and sudden degenerate increment, exceeds the soft failure threshold level. On the other hand, hard failure occurs when the time interval between two successive shocks is less than the recovery time. As time progresses and natural degradation, the time for a system to recover from damage due to shocks tends to increase gradually. However, conventional models usually regard recovery time as a constant, unrealistic in many practical situations. For this purpose, an increment‐dependent shock process is considered. A hard failure reliability model with recovery time is calculated using the GPP to describe the shock arrival process. On this basis, combined with the deduced soft failure function, the analytical solution of the reliability model is obtained. Finally, a numerical example based on the micro‐electro mechanical systems is conducted to illustrate the effectiveness of the proposed model.

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Design of a Shock-Protected Structure for MEMS Gyroscopes over a Full Temperature Range

Xu,

Lin,

et al. 2024

Micromachines

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Impact is the most important factor affecting the reliability of Micro-Electro-Mechanical System (MEMS) gyroscopes, therefore corresponding reliability design is very essential. This paper proposes a shock-protected structure (SPS) capable of withstanding a full temperature range from −40 °C to 80 °C to enhance the shock resistance of MEMS gyroscopes. Firstly, the shock transfer functions of the gyroscope and the SPS are derived using Single Degree-of-Freedom and Two Degree-of-Freedom models. The U-folded beam stiffness and maximum positive stress are deduced to evaluate the shock resistance of the silicon beam. Subsequently, the frequency responses of acceleration of the gyroscope and the SPS are simulated and analyzed in Matlab utilizing the theoretical models. Simulation results demonstrate that when the first-order natural frequency of the SPS is approximately one-fourth of the gyroscope’s resonant frequency, the impact protection effect is best, and the SPS does not affect the original performance of the gyroscope. The acceleration peak of the MEMS gyroscope is reduced by approximately 23.5 dB when equipped with the SPS in comparison to its counterpart without the SPS. The anti-shock capability of the gyroscope with the SPS is enhanced by approximately 13 times over the full-temperature range. After the shock tests under the worst case, the gyroscope without the SPS experiences a beam fracture failure, while the performance of the gyroscope with the SPS remains normal, validating the effectiveness of the SPS in improving the shock reliability of MEMS gyroscopes.

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Reliability analysis for competing failure processes with mutual dependence of the system under the cumulative shock

Cited by 3 publications

References 21 publications

Reliability of MEMS inertial devices in mechanical and thermal environments: A review

Reliability of MEMS inertial devices in mechanical and thermal environments: A review

Reliability modeling of dependent competing failure processes based on time‐dependent threshold level δ and degradation rate changes

Design of a Shock-Protected Structure for MEMS Gyroscopes over a Full Temperature Range

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