Release of moving silicon microstructures embedded in a bonded multi-wafer stack using DRIE

Hergert, R. J.; Karl, W.J.; Holmes, Andrew S.

doi:10.1109/transducers.2013.6626727

2013 Transducers &Amp; Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems 2013

DOI: 10.1109/transducers.2013.6626727

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Release of moving silicon microstructures embedded in a bonded multi-wafer stack using DRIE

R. J. Hergert

W.J. Karl

Andrew S. Holmes

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Release of moving silicon microstructures embedded in a bonded multi-wafer stack using DRIE

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References 7 publications

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