Relationship of Mechanical and Micromechanical Properties with Microstructural Evolution of Sn-3.0Ag-0.5Cu (SAC305) Solder Wire Under Varied Tensile Strain Rates and Temperatures

Influence of Thermomechanical Processing on Micromechanical Properties of SN-0.7CU Solder Alloy via Nanoindentation Approach

“…These values were respectively 2.5× and 1.5× lower than the hardness of thermomechanicalprocessed sample with 40% and 80% thickness reduction at the same temperature. The trend of the result is same as previous study conducted on SAC305 solder wire that were heat-treated at temperature range of 25-200°C [6]. The results show that increasing temperature caused negative properties of hardness of SAC305 solder wire.…”

“…Nowadays, lead-free solder alloys such as Sn-Cu, Sn-Bi, Sn-In, and Sn-Zn have recently emerged as viable alternatives to lead solder alloys [3,4]. Many studies have been done to look at the potential of lead-free solder alloys in terms of mechanical properties [4][5][6][7]. The properties of solder materials continue to be improved over time to address challenges due to continuous advances in electronic packaging technology towards size reduction and multifunction devices [8,9].…”

Microstructure Evaluation of Photovoltaic Solar Panel’s Interconnection: A Review

“…The physical analysis founded the grain coarsening, intermetallic compounds volume increase, and the grain boundaries growth [9], [10]. Besides, Abdullah et al discovered the grain size coarsening due to recrystallization phenomenon effected by elevated temperature [7]. Fig.…”

“…Similarly, solders are also used in microelectronics packaging. Lead-free solder alloys are now mainly used in the industry as electrical interconnects to fulfill the safety and health regulation [6][7][8][9][10]. Eslami and Ekere discovered that the failure in the ribbon interconnection were associated to the thermal crack in the solar joint material's production process due to high temperature [11].…”

“…Geipel et al, Chen et al and Jabarullah et al investigated the microstructure and intermetallic growth of the solder joint's cross section for PV module interface [9,11,12]. On the other hand, Abdullah et al evaluated the grain size and grain aspect ratio of the solder joint's to investigate the relationship of mechanical properties, micromechanical properties and the microstructure of SAC305 lead-free solder wires [7]. Moreover, Alam et al and Ab Rahim et al evaluated the microstructure of the solder joints for the electronics industry to investigate the coarsening of intermetallic particles that occurred due to aging [8], [10] while Heimann et al studied the effect of weak solder joint caused by low wetting failure mode of PV module [14].…”