Relationship of catalytic activities of nickel‐copper alloys to recent determinations of their electronic structure

Abstract

Homogeneous Ni‐Cu alloy films formed in ultra‐high vacuum show persistence of activity for the ethane/deuterium exchange reaction at 300‐380d̀C to low Ni content (4%), although activity is reduced compared to 100% Ni; Cu films are inactive at 450° or lower.This form of pattern confirms those reported previously for C ‐ H and H ‐ H bond activation on films prepared in conventional vacuum. Results now available on the (bulk) electronic characteristics of Ni ‐ Cu solutions make possible a unified interpretation (basically through the “individual atom” approach) for these patterns. Attention is drawn to such additional influences as nearest‐neighbour interaction within the alloy and, at low Ni contents, diminished mobility of d‐vacancies.