1978
DOI: 10.1016/0032-3861(78)90285-9
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Relationship between mechanical properties of and crack progogation in epoxy resin adhesives

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Cited by 131 publications
(49 citation statements)
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“…For the epoxy adhesive, from dynamic mechanical thermal analysis (DMTA) studies, the value of tanδ r at room temperature and a relatively low test frequency of 1 rad/s is 0.014 [16]. From Equation (5) Thus, from (a) the current values of n being very similar as deduced from the fracture tests and the DMTA studies and (b) by analogy to previous work [13][14][15], it appears that the viscoelastic processes which operate in the vicinity of the crack tip control the rate dependence of the toughness, G c , of the present adhesive joints. This explains why no effect of the RH, substrate type or surface pretreatment used is observed with respect to the rate dependence; i.e.…”
Section: The Relationship Between G C and Asupporting
confidence: 56%
See 1 more Smart Citation
“…For the epoxy adhesive, from dynamic mechanical thermal analysis (DMTA) studies, the value of tanδ r at room temperature and a relatively low test frequency of 1 rad/s is 0.014 [16]. From Equation (5) Thus, from (a) the current values of n being very similar as deduced from the fracture tests and the DMTA studies and (b) by analogy to previous work [13][14][15], it appears that the viscoelastic processes which operate in the vicinity of the crack tip control the rate dependence of the toughness, G c , of the present adhesive joints. This explains why no effect of the RH, substrate type or surface pretreatment used is observed with respect to the rate dependence; i.e.…”
Section: The Relationship Between G C and Asupporting
confidence: 56%
“…Previous workers [13][14][15] have found a similar relationship for crack growth in thermoplastic and thermosetting polymers, which is also associated with a relatively low value of n. Williams [14] has postulated that viscoelastic processes occurring at the crack tip control the dependence of G c upon the crack velocity, a  , and that the value of n is related to the polymer's viscoelastic properties by:…”
Section: The Relationship Between G C and Amentioning
confidence: 91%
“…The mechanism of plastic void growth in an epoxy matrix has been modeled by Huang and Kinloch, who find that this contribution to the toughness of a rubber-toughened epoxy is negligible at reduced temperatures [75]. As T. of the epoxy was approached, however, the inelastic growth of voids became the major consumer of energy due to the sharp reduction in yield stress.…”
Section: Cavitationmentioning
confidence: 99%
“…The epoxy system based on the reaction of the difunctional epoxy monomer diglycidyl ether of bisphenol-A, DGEBA, with aliphatic amines is such an example. The properties of this and other epoxy systems can be varied as a function of the molecular weight of the hardener molecule [7][8][9][10] , by variations in processing conditions [11][12][13] or by the use of different hardener to monomer ratios 8,11,[13][14][15][16][17][18][19][20][21] . This last variable introduces boundary condition (i.e., when a variable like temperature or the amount of monomers is changed).…”
Section: Introductionmentioning
confidence: 99%