Relationship between Diffusion and Adhesion Properties of Ferroelectric Thin-Film Structure on Releasable Substrate

Abstract

Pb(Zr0.52,Ti0.48)O3 thin-films with various thicknesses were prepared on releasable Pt/SiO2/Si substrates. The adhesion force between Pt and SiO2 was estimated, mainly in the viewpoint of the diffusion of Pb, in X-ray photoelectron spectroscopy (XPS) and tensile test for the clarification of the bonding properties of the nano-transfer method. The adhesion strength of Pt to SiO2 has an inverse linear relationship with the thickness of Pt. On the other hand the adhesion strength of the samples, that were crystallized with different number of layers, were shown to be in the same region of 2–4 MPa as in case of PZT with over 250 nm in thickness. These results indicate that the origin of the bonding is the diffusion of Pb in the film and that the bonding strength is connected with the earlier stage of crystallization.

Multitarget Sputtering of Piezoelectric Mixed Oxide Thin Films onto Flexible Substrates

“…However, deposition of ceramic films onto a polymer film is limited by the requirement of low-temperature processing. Therefore, either oxide-resin composites are used for ink-jet printing [1] or perovskite oxide dies processed separately on releasable substrates are transferred to polymer substrates [2,3].…”