2008
DOI: 10.1016/j.jnoncrysol.2007.09.084
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Relation between substrate surface morphology and microcrystalline silicon solar cell performance

Abstract: In the present paper, the structural and electrical performances of microcrystalline silicon (lc-Si:H) single junction solar cells codeposited on a series of substrates having different surface morphologies varying from V-shaped to U-shaped valleys, are analyzed. Transmission electron microscopy (TEM) is used to quantify the density of cracks within the cells deposited on the various substrates. Standard 1 sun, variable illumination measurements (VIM) and Dark J(V) measurements are performed to evaluate the el… Show more

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Cited by 190 publications
(137 citation statements)
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(13 reference statements)
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“…The improvement of FF between 170 and 2308C can then be attributed, as expected, to the decrease of cracks density (already seen in Ref. [15]). Indeed, this latter is reduced by 50% for slightly surface treated ZnO (black squares on Figure 3a) and by 87% for strongly surface treated ZnO (red circles on Figure 3a) when the temperature is raised from 170 to 2708C.…”
Section: Effect Of Substrate Temperature On Electrical Performancessupporting
confidence: 79%
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“…The improvement of FF between 170 and 2308C can then be attributed, as expected, to the decrease of cracks density (already seen in Ref. [15]). Indeed, this latter is reduced by 50% for slightly surface treated ZnO (black squares on Figure 3a) and by 87% for strongly surface treated ZnO (red circles on Figure 3a) when the temperature is raised from 170 to 2708C.…”
Section: Effect Of Substrate Temperature On Electrical Performancessupporting
confidence: 79%
“…Depending on the transparent conductive oxide (TCO) growth process conditions and on the ''sharpness'' of the V-shapes, such as TCO surface morphology, can lead to severe degradation of the performances of mc-Si:H solar cells, as those are particularly sensitive to cracks that appear in the intrinsic layer because of the V-shape. As already demonstrated in previous works [15,16], these cracks have mainly detrimental effects on the fill factor (FF) and open-circuit voltage (V oc ), and act as bad diodes with a high reverse saturation current. In Ref.…”
Section: Introductionmentioning
confidence: 68%
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“…41 This could explain the discrepancy between the estimated 17% and the observed 12% improvement in FF when going from single to tandem junction. A detailed statistical analysis of the crack distribution 47 is out of the scope of the present work. However, new approaches to reduce the number of cracks and to limit their negative impact on the V oc and FF of the cells are currently being intensively investigated in our lab.…”
mentioning
confidence: 99%