Relating yield models to burn-in fall-out in time

Barnett, T.S.; Singh, A.D.

doi:10.1109/test.2003.1270827

Cited by 21 publications

(16 citation statements)

References 11 publications

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“…1). In particular, the failure rate in this stage decreases with usage time, and the corresponding reliability function follows two-parameter Weibull distribution [15], which is related to the core structural properties and usage-related factors (e.g., operational voltage and frequencies) [16], [17]. By stressing the circuit at elevated temperature and voltage during burn-in test, the number of latent defect-induced failures increases and these weak chips can be identified.…”

Section: A Preliminariesmentioning

confidence: 99%

“…The reliability function of latent defects follows twoparameter Weibull distribution [15], which has the form…”

Section: A Impact Of Partial Burn-inmentioning

confidence: 99%

“…Assuming that all latent defects reveal themselves after full burn-in time T IM [15], we are enabled to eliminate the scale parameter from (1). To be specific, by the assumption, the reliability induced by latent defects is given by…”

Section: A Impact Of Partial Burn-inmentioning

confidence: 99%

“…We set the system parameters based on prior work as follows: v = 0.002 [19], µ = 18 [27], α = 0.3 [13], β = 0.3, ξ = 0.2 [15], d = 300 mm, A r = 10 mm 2 , η = 95% unless otherwise specified. The product quality requirement is set to 500 DPPM (i.e., τ = 5 × 10 −4 ) unless specified otherwise.…”

Section: A Experimental Setupmentioning

confidence: 99%

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Economic Analysis of Testing Homogeneous Manycore Chips

Huang

2010

IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

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Abstract-The employment of a large number of structurally identical cores on a single silicon die is generally regarded as a promising solution for tera-scale computation, known as manycore chips. To ensure the product quality of such complex integrated circuits before shipping them to final users, extensive manufacturing tests are necessary and the associated test cost can account for a large share of the total production cost. By introducing spare cores on-chip, the burn-in test time can be shortened and the defect coverage requirements for core tests can be also relaxed, without sacrificing quality of the shipped products. If the above test cost reduction exceeds the manufacturing cost of the extra cores, the total production cost of manycore chips can be reduced. In this paper, we develop novel analytical models to study the above tradeoff and we verify the effectiveness of the proposed test economics model for hypothetical manycore chips with various configurations.Index Terms-Analytical model, manycore chip, product quality test economics.

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Section: A Preliminariesmentioning

confidence: 99%

“…The reliability function of latent defects follows twoparameter Weibull distribution [15], which has the form…”

Section: A Impact Of Partial Burn-inmentioning

confidence: 99%

Section: A Impact Of Partial Burn-inmentioning

confidence: 99%

Section: A Experimental Setupmentioning

confidence: 99%

See 2 more Smart Citations

Economic Analysis of Testing Homogeneous Manycore Chips

Huang

2010

IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

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show abstract

“…1). The first stage (caused by latent defects) is commonly referred as infant mortality period, and its reliability function follows Weibull distribution with shape parameter β and scale parameter θ [1], which reflect the core structural properties and usage-related factors (such as, operational voltage and frequencies), respectively [9]. Before burn-in process, latent defects are not significant enough to reveal themselves.…”

Section: Introductionmentioning

confidence: 99%