1982
DOI: 10.1109/edl.1982.25469
|View full text |Cite
|
Sign up to set email alerts
|

Refractory MoSi2and MoSi2/polysilicon bulk CMOS Circuits

Abstract: Refractory MoSi, and MoSi, /polysilicon have been used to fabricate high-performance 3~m bulk CMOS circuits. Thirty-nine stage ring oscillators, with a fan-in and fan-out of 1, exhibit a switching delay/stage of 1.2 to 1.4115, and a power-delay product of 0.22 to 0.25pJ at a supply voltage of 5 V. The powerdelay product ranges from 40fJ for a delay of 9ns to 1pJ for a delay of 0.611s. Self-cheoking pattern generator circuits implemented with the same technology show an operating frequency as high as 80 MHz, wh… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
1
0

Year Published

1982
1982
1989
1989

Publication Types

Select...
6

Relationship

0
6

Authors

Journals

citations
Cited by 6 publications
(1 citation statement)
references
References 8 publications
(1 reference statement)
0
1
0
Order By: Relevance
“…In the course of development of a refractory and highly conductive interconnection system for verylarge-scale-integrated (VLSI) circuits, several refractory metal silicides, such as MoSi2 (1)(2)(3)(4)(5), WSi2 (6)(7)(8)(9), and TaSi2 (10,11), are under study as an alternative to the widely used doped polycrystalline silicon (poly-Si). These .metal silicides, unlike the metals, have resistance to high temperature oxidation and to most chemicals routinely encountered during device fabrication.…”
mentioning
confidence: 99%
“…In the course of development of a refractory and highly conductive interconnection system for verylarge-scale-integrated (VLSI) circuits, several refractory metal silicides, such as MoSi2 (1)(2)(3)(4)(5), WSi2 (6)(7)(8)(9), and TaSi2 (10,11), are under study as an alternative to the widely used doped polycrystalline silicon (poly-Si). These .metal silicides, unlike the metals, have resistance to high temperature oxidation and to most chemicals routinely encountered during device fabrication.…”
mentioning
confidence: 99%