The effect of phosphorus implantation into d-c magnetron sputtered MoSi~ thin films is studied. The structural compositional, and electrical properties are examined with x-ray diffraction, secondary ion mass spectrometry (SIMS), sheet resistance, and MOS measurements. A higher hexagonal to tetragonal MoSi~ phase transition temperature is observed for implanted films than for unimplanted ones. At high fluence (5 • 10 TM ions/cmD. MoP is detected, with a significant increase in sheet resistance. Isothermal and isochronal annealing indicates a minimum temperature of 950~ and a maximum fluence of 2 • 10 '6 ions/cm ~ can be used. Comparative C-V measurements show similar MOS characteristics between unimplanted and implanted films.In the course of development of a refractory and highly conductive interconnection system for verylarge-scale-integrated (VLSI) circuits, several refractory metal silicides, such as MoSi2(1-5), WSi2 (6-9), and TaSi2 (10, 11), are under study as an alternative to the widely used doped polycrystalline silicon (poly-Si). These .metal silicides, unlike the metals, have resistance to high temperature oxidation and to most chemicals routinely encountered during device fabrication.Since the gate metal is often used as ion implantation mask during the source/drain doping in a selfaligned process, the effect of implantation of various group III and V ions, phosphorus, arsenic, and boron, on the properties of silicide thin films needs to be studied. Also, recently, it has been reported (12, 13) that doping MoSi2 films with phosphorus can help stabilize silicide-gate threshold voltage and form low resistant and reliable contacts between silicide and silicon substrates. In that study, doped silicide films were deposited by using an Mo/Si target in a phosphine/argon atmosphere. In this paper, the effect of phosphorus implantation on the structural, compositional, and electrical characteristics of sputtered molybdenum disflicide thin films is investigated. Also, its effect on the flatband voltage and threshold stability of silicide-gate MOS capacitors is studied.
Experimental ProcedureMolybdenum disilicide films, nominally 3000A. thick, were deposited onto oxidized silicon substrates. The sputtering was done in an MRC 603 system using d-c magnetron from an alloy target of stoichiometric proportion. The parameters used were 2 kW of power and 3~ of argon pressure. Then, phosphorus was implanted into the silicide films with a dose ranging from 1015 and 5 X 1016 ions/cm 2. The implantation energy was calculated using an interpolation program based on Brice (14). Silicon and molybdenum were used as interpolating points. The density of MoSi2 was assumed to be 5.7 g/cm 8, which was measured on sputtered thin films (15) and was less than the values of 5.9-6.3 g/cm 3 reported for bulk silicide (16). The projected range and straggle, Rp and ~Rp, were calculated for boron (Bn), phosphorus (pzl), arsenic (As~5), and antimony (Sb121), using their range data in Si and Mo given by Smith (17). These are shown in Fig. 1 an...