Refractory Metals and Their Alloys

Pink, E.; Eck, R.

doi:10.1002/9783527603978.mst0088

Cited by 6 publications

(4 citation statements)

References 44 publications

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“…[ 10 ] Despite the advantages listed previously, Mo or TZM have yet to find wide adoption in high‐temperature applications because of the limitations in manufacturing complex parts with intricate geometry using conventional processes. [ 4,6 ]…”

Section: Introductionmentioning

confidence: 99%

“…[3][4][5] TZM is a Mo alloy which nominally contains 0.5 wt% titanium, 0.08 wt% zirconium, and between 0.01 to 0.04 wt% carbon. [6] Although more expensive than pure Mo, TZM has a higher recrystallization temperature (1673 K) and offers improved strength at elevated temperatures (>300 MPa even at 1473 K) from the development of Mo and Ti carbides and Zr and Ti oxides precipitates strengthening grain boundaries. [7][8][9] Although rolling and arc casting are practiced for basic shapes out of Mo and TZM, due to their refractory nature, most of the parts are fabricated via conventional powder metallurgy (PM) route like metal injection molding.…”

mentioning

confidence: 99%

“…[10] Despite the advantages listed previously, Mo or TZM have yet to find wide adoption in high-temperature applications because of the limitations in manufacturing complex parts with intricate geometry using conventional processes. [4,6] Copper is an ideal heat sink material due to its excellent thermal diffusivity (≈115 Â 10 6 m 2 s À1 ), but the significant difference in the coefficient of thermal expansion (CTE) between Cu (17.0 Â 10 À6 K À1 ) and semiconductors (5.7 to 7.0 Â 10 À6 K À1 ) presents a disadvantage for its use as a heat sink. [11][12][13] High junction temperature and interfacial stresses generated by the mismatch in the thermal expansion between Cu and the semiconductors result in debonding issues.…”

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confidence: 99%

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Laser Powder Bed Fusion Additive Manufacturing of Mo and TZM Exoskeleton with Cu Infiltration for New Heat Sinks Configuration

Ramakrishnan,

Kumar,

Hudon

et al. 2023

Adv Eng Mater

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This study reports the fabrication and characterization of molybdenum (Mo) metal and titanium‐zirconium‐molybdenum (TZM) alloy exoskeletons with honeycomb cavity structures (HCS) that are infiltrated with oxygen‐free high conductivity (OFHC) Cu under an inert atmosphere as a potential replacement for Cu‐Mo‐Cu laminate in heat sink applications for power electronics semiconductors like GaAs. The thermal expansion behavior and the thermal loading of the starting Mo and TZM structures, and of the Cu‐infiltrated parts are evaluated. The fabricated Mo and TZM structures with density >99% and Mo‐based heat sinks with improved CTE (6.6 × 10−6 K−1) when compared to conventional Cu‐Mo‐Cu laminated heat sinks (CTE = 7.6 × 10−6 K−1). The new Mo and TZM structures promise superior performance due to their closer CTE to that of GaAs and similar semiconductors (CTE = 5.7 × 10−6 K−1). Exposure to temperatures up to 1073 K did not affect the Mo microstructure due to the inherent resistance to recrystallization, while exposure to 1373 K did reduce hardness. In contrast, TZM exoskeletons showed resistance to recrystallization even at 1373 K. The fabricated composite heat sinks showed thermal diffusivity (≈61 × 106 m2 s−1) that is within the upper limits of those reported for commercial laminated heat sinks (45 to 65 × 106 m2 s−1).

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Section: Introductionmentioning

confidence: 99%

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Laser Powder Bed Fusion Additive Manufacturing of Mo and TZM Exoskeleton with Cu Infiltration for New Heat Sinks Configuration

Ramakrishnan,

Kumar,

Hudon

et al. 2023

Adv Eng Mater

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“…Refractory high entropy alloys (RHEAs), introduced in the pioneering works by Senkov et al [ 1 , 2 ], revived the interest in refractory metals as potential materials for next-generation gas turbine engines [3] . The firstly reported NbMoTaW and VNbMoTaW RHEAs with single-phase body-centred cubic (bcc, A2) structures outperformed the state-of-art nickel-based superalloys at T > 1000 °C and retained extraordinary strength up to 1600 °C.…”

Section: Introductionmentioning

confidence: 99%