more, the ICPA has a much shorter distance to the radio-frequency output of the wireless transceiver than a conventional antenna. This implies a smaller transmission loss, which can be translated as an enhancement to the ICPA radiation efficiency by a few percent.
CONCLUSIONThe prototype ICPA, printed on a 28-pin dual-in-line integratedcircuit-pressed ceramic package, has been fully studied from the antenna viewpoint for the single-chip solutions of wireless transceivers at the 2.4-GHz band using deep submicron COMS technology. The fabrication of the ICPA is compatible with standard integrated-circuit-pressed ceramic-package technology. It has been demonstrated that CMOS chip loading greatly increases the impedance bandwidth, but slightly decreases the radiation efficiency of the ICPA. The loaded ICPA achieved impedance bandwidth of 15.7%, radiation efficiency of 64 Ϯ 4%, and gain of Ϫ2.0 dBi. These performance parameters of the ICPA are sufficient for Bluetooth and many other applications.This novel ICPA has opened up many opportunities for further research and development. Firstly and most importantly, the ICPA should also be studied from the circuit viewpoint in order to understand the effect of the ICPA on the signal integrity of the single-chip wireless transceivers. This is believed to be quite a challenging work and has received our utmost attention. Secondly, as the surface-mount integrated-circuit ceramic-ball grid-array package is usually chosen for the single-chip solutions of wireless transceivers, the performances of the ICPA implemented on this type package are certainly worthy of investigation. Thirdly, printed antenna candidates with better efficiency should be developed for ICPA applications. Finally, the codesign tool of CMOS integrated circuits-the ceramic package-and the antenna should be made available for the successful realization of single-chip wireless transceivers.