Reflectance spectroscopy: application of the Kubelka-Munk theory to the rates of photoprocesses of powders

Abstract

The Kubelka-Munk theory of reflectance spectroscopy is used to derive an approximate equation that describes the rate of the photoprocess of a powdered sample in terms of the remission function. The equation is compared with one obtained using the particle model theory of diffuse reflectance and with experimental data for the photochemical reaction of powdered K(3)[Fe(C(2)O(4))(3)]-3H(2)O.

Pushing the Limits of Metastability in Semiconducting Perovskite Oxides for Visible-Light-Driven Water Oxidation

“…The background was a pressed barium sulfate disc. The data were transformed by using the Kubelka–Munk, F ( R ), function . Because F ( R ) is also equal to k / s , where k and s are the absorption and scattering coefficients, the bandgaps can be extracted via Tauc plots of ( F ( R ) × h ν ) n versus photon energy for the allowed direct ( n = 2) and indirect ( n = 1/2) transitions.…”

In Situ g‐C3N4@Zno Nanocomposite: One‐Pot Hydrothermal Synthesis and Photocatalytic Performance under Visible Light Irradiation

“…From the DRS data, there are routes to get the information of bandgap value (called optical bandgap) indirectly using modified Kubelka-Munk function [36][37][38].…”

“…where F(R) is determined from diffuse reflectance R via the formula F (R) � (1-R) 2 /2R; h] is the incident photon energy; D is an arbitrary coefficient; n � ½ and 2 for direct and indirect allowed recombinations, respectively, and E g is the optical bandgap of the sample [38].…”

Bio-inspired engineering of a zinc oxide/amino acid composite: synchrotron microstructure study

“…Similar lattice strain relaxation after annealing has been described in bio-inspired synthetic and biogenic calcite. [14][15][16]25 By measuring diffuse reflectance spectra using a Cary 5000 UV-spectrophotometer and using the Kubelka-Munk method for band-gap estimation, [30][31][32] we screened the bandgap alteration of ZnO/amino acid composites before and after thermal annealing (Fig. 1).…”