Reel-to-Reel Fabrication of Integrated Circuits Based on Soluble Polymer Semiconductor

Klink, G.; Hammerl, E.; Drost, A.; Hemmetzberger, Dieter; Bock, Karlheinz

doi:10.1109/polytr.2005.1596477

Cited by 6 publications

(7 citation statements)

References 5 publications

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“…The top part of Figure 6 shows the schematic configuration of our polymer electronic circuits 6 . Our process starts from pre-metallized PET-foil, which is fine-structured by photolithography and wet etching via the process detailed above to create the source-drain-layer for the polymer electronic circuits.…”

Section: From Processes To Microsystems In Roll-to-rollmentioning

confidence: 99%

Roll-To-Roll Microfabrication of Polymer Microsystems

Strohhöfer

Klink

Feil

et al. 2007

Measurement and Control

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Section: From Processes To Microsystems In Roll-to-rollmentioning

confidence: 99%

Roll-To-Roll Microfabrication of Polymer Microsystems

Strohhöfer

Klink

Feil

et al. 2007

Measurement and Control

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“…Figure 2 shows copper lines of 20 ptm width that were electroplated to a thickness of approximately 7 ptm, starting from a photolithographically structured 500 nm thick Cu layer on polyimide foil. The specific resistivity of electroplated Cu leads amounts to 1.9 ptQcm, comparable to standard Cu resistivity of 1.8 ptQcm [3]. Therefore high density interconnects and higher current conductor patterns can be provided in this process too.…”

Section: Motivationmentioning

confidence: 82%

“…Processing speed depends on the thickness of the layer to be etched and retention time in the etch bath. In general, wet etching is a relatively slow process and often constitutes the time-determining step in the process flow [2,3]. Figure 1 shows an interdigitated capacitor with lines and spaces of 15 ptm width.…”

Section: Motivationmentioning

confidence: 99%

“…With a spot size of 20 ptm and an accuracy of 10 ptm, the system shows comparable nerformance to qtationa.rv trim l..qerq figure 4 shows the cross-section of the complete process for organic TFT and the lower part of figure 4 depicts a finished polymer electronic circuit, a ring oscillator, with whose help the quality of and switching speed achieved with the technology and design can be evaluated. Further circuits, like logic gates and analog circuits, are under development at present [3,4].…”

Section: Motivationmentioning

confidence: 99%

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Large Area Cost-Efficient Electronics Systems Integration

Bock

Klink

Strohhöfer

et al. 2007

2007 Proceedings 57th Electronic Components and Technology Conference

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Polymer electronic is expected to be a promising technology for low-cost and large-area electronic systems to support information and communication technology, sensor networks, life sciences, medical and bio-sensing devices, which can not easily be addressed by traditional chip technology.Solutions of polymer or polymer based pastes offer advantages due to their easy processing possibilities which give the opportunity to coat and pattern them like a printing ink. Hence reel-to-reel manufacturing with endless substrates of foil is a key technology to fulfil the challenging cost demands of cheap flexible systems.However printing resolution and registration as well as the electrical performance of polymer materials request at present still a hybrid approach based on most-polymer materials and partially-printed technologies to reach reasonable performance of systems. The process integration presented is based on a photolithographic process for the first level based on metallized foils, which is used to pattern the first interconnect and electrode layer with low resistance and high resolution compared to printing. With two subsequent lacquering and three screen printing steps for example polymer field effect transistors as well as sensors and actuators are integrated to circuits.Moreover this approach enables the possibility to use such functional flexible foil substrates for the hetero-integration of cost-efficient systems merging thin silicon chips with further thin, flexible or printed electronic components, sensors actuators batteries displays and even micro-fluidics andpneumatics on a foil substrate. This paper prevents an overview over the hybride heterointegration approach for flexible electronic foil systems so-called polytronics developed at Fraunhofer IZM [1,2].

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“…The IZM process for manufacturing integrated circuits is based on solution processed polymer semiconductor materials [6], [7], [8] and [9]. Basis is a reel-to-reel working photolithographic patterning process for metallized foils, which is used to fabricate the basic source-drain layer with high resolution.…”

Section: Fabrication Processmentioning

confidence: 99%

Polymer electronics towards system integration

Bonfert

Klink

Bock

2010

33rd International Spring Seminar on Electronics Technology, ISSE 2010

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Polymer electronics, or Polytronics, as the short name, is a promising technology for low-cost and large-area electronic systems, based on novel organic materials with conducting and semiconducting properties, not addressable by conventional silicon technology. The new properties of this plastic materials are a combination of the electronic and optical properties of metals and semiconductors and the properties of polymers and small molecules. Using active and passive electronic and photonic components, based on organic materials, allows system integration for a specific application. These systems can be made on flexible foil substrates, allowing the processing of large area electronics

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Reel-to-Reel Fabrication of Integrated Circuits Based on Soluble Polymer Semiconductor

Cited by 6 publications

References 5 publications

Roll-To-Roll Microfabrication of Polymer Microsystems

Roll-To-Roll Microfabrication of Polymer Microsystems

Large Area Cost-Efficient Electronics Systems Integration

Polymer electronics towards system integration

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