Reduction of thermal conductivity in wafer-bonded silicon

Liau, Z. L.; Danielson, L. R.; Fourspring, Patrick M.; Hu, Lu; Chen, Gang; Turner, G. W.

doi:10.1063/1.2959063

“…In addition, a specific need for very thin wafers has been created by the introduction of smart cards, where dice need to be thin enough to be laminated as part of a plastic card. The other driving force for the reduction of silicon wafer thickness is the relatively poor thermal conductivity of thick silicon wafers (3].…”

Section: List Of Figuresmentioning

confidence: 99%

Thin wafer dicing using a high repetition rate femtosecond laser

Sudani¹

2021

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“…The laser pulsewidth is shorter than the electron relaxation time, which is on the order of picoseconds. By the time the laser beam is turned off, the system is out of equilibrium as the electrons are at a much higher temperature than the ions [19,20]. The hot electron relaxation dynamics in metals after the excitation by a femtosecond laser pulse has been intensively studied during the last decade [38,39,40].…”

Section: Femtosecond Laser Ablationmentioning

confidence: 99%

Submicron and nano surface patterning using nanosecond laser technique

Husein¹

2021

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0

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Direct writing by laser techniques in the micro and nanostructuring scale is very important for the fabrication of new materials and multifunctional devices. They have proven to be very successful tools for precision machining and microfabrication with applications in optical devices, microelectronics, medical device, biomedical, defense applications, and MEMS. Focused nanosecond (ns) laser pulses can produce periodic structures and arrays pattern structures in semiconductors and thin metallic film on shaped surfaces. The achievable structure size is restricted by the wavelength and diffraction limit as well as it is determined by material properties and laser pulse stability. This thesis proposes a nanosecond laser nanostructuring technique in common optical path configuration to examine the limitations of the currently used fabrication methods and type of setups used; the competitive edge is using nanosecond lasers as a tool. Prospectively, this technology can be applied for femtosecond laser fabrication, because this is an easy, simple and common optical path configuration. For this experimental setup, the use of a common optical path configuration for automatic interference offers equals path lengths. It is not required for complicated optical setups while in femtosecond laser setups, it is extremely important to use path compensation in order to offer time delay for one laser beam due to a long path and more optical components. A low repetition rate, low power nanosecond laser system is investigated to preventing the (HAZ) conditions. The influence of the laser repetition rate and pulse energy on the size and quality of submicron features which fabricated on silicon wafers and thin gold film is investigated. In terms of nanomachining below the ablation threshold (surface patterning), the influence of laser fluence, repetition rate and pulse energy on the spacing as well as diameter of dots created on silicon wafer surface is examined. These studies show the capability of the proposed system of nanosecond laser in common optical path configuration in meeting the industry requirements.

show abstract

“…The laser pulsewidth is shorter than the electron relaxation time, which is on the order of picoseconds. By the time the laser beam is turned off, the system is out of equilibrium as the electrons are at a much higher temperature than the ions [19,20]. The hot electron relaxation dynamics in metals after the excitation by a femtosecond laser pulse has been intensively studied during the last decade [38,39,40].…”

Section: Femtosecond Laser Ablationmentioning

confidence: 99%

Submicron and nano surface patterning using nanosecond laser technique

Husein¹

2021

Preprint

0

View full text Add to dashboard Cite

Direct writing by laser techniques in the micro and nanostructuring scale is very important for the fabrication of new materials and multifunctional devices. They have proven to be very successful tools for precision machining and microfabrication with applications in optical devices, microelectronics, medical device, biomedical, defense applications, and MEMS. Focused nanosecond (ns) laser pulses can produce periodic structures and arrays pattern structures in semiconductors and thin metallic film on shaped surfaces. The achievable structure size is restricted by the wavelength and diffraction limit as well as it is determined by material properties and laser pulse stability. This thesis proposes a nanosecond laser nanostructuring technique in common optical path configuration to examine the limitations of the currently used fabrication methods and type of setups used; the competitive edge is using nanosecond lasers as a tool. Prospectively, this technology can be applied for femtosecond laser fabrication, because this is an easy, simple and common optical path configuration. For this experimental setup, the use of a common optical path configuration for automatic interference offers equals path lengths. It is not required for complicated optical setups while in femtosecond laser setups, it is extremely important to use path compensation in order to offer time delay for one laser beam due to a long path and more optical components. A low repetition rate, low power nanosecond laser system is investigated to preventing the (HAZ) conditions. The influence of the laser repetition rate and pulse energy on the size and quality of submicron features which fabricated on silicon wafers and thin gold film is investigated. In terms of nanomachining below the ablation threshold (surface patterning), the influence of laser fluence, repetition rate and pulse energy on the spacing as well as diameter of dots created on silicon wafer surface is examined. These studies show the capability of the proposed system of nanosecond laser in common optical path configuration in meeting the industry requirements.

show abstract

Reduction of thermal conductivity in wafer-bonded silicon

Cited by 5 publications

References 14 publications

Thin wafer dicing using a high repetition rate femtosecond laser

Thin wafer dicing using a high repetition rate femtosecond laser

Submicron and nano surface patterning using nanosecond laser technique

Submicron and nano surface patterning using nanosecond laser technique

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