Reduction of background in CR-39 SSNTD using chemical pre-etching methods

Rohatgi, Rupali; Sathian, Deepa; Jayalakshmi, V.; Nair, Sarala; Marathe, P.K.; Chaurasiya, G.; Kannan, S.

doi:10.1007/s12648-009-0038-7

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“…This tech nique is known as the com bined etch ing technique (CPE+ECE). It re moves the su per fi cial shal low de fects which may pro duce back ground tracks and is stan dard ized [23].…”

Section: Etch Ing Tech Niquesmentioning

confidence: 99%

Development and dosimetric characterization of indigenous PADC for personnel neutron dosimetry

Pal¹,

Nadkarni²,

Naik³

et al. 2015

NUCL TECH RAD PROT

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CR-39 is a solid state nu clear track de tec tor, chem i cally known as poly-allyl-diglycol-car bonate, widely used for per son nel neu tron mon i tor ing be cause of its sen si tiv ity to neu trons, excel lent op ti cal prop er ties that fa cil i tate the anal y sis and suf fi ciently long shelf life. Pres ently, this de tec tor is im ported and is be ing used for the per son nel neu tron mon i tor ing programme in In dia. Hence, an ef fort was made to wards the in dig e nous de vel op ment of these de tec tors. Dif fer ent chem i cal pro cesses for the in dig e nous de vel op ment of the poly-allyl-diglycol-carbon ate de tec tor, such as the syn the sis of allyl-diglycol-car bon ate mono mer and isopropylperoxydicarbonate as ini ti a tors for the poly mer iza tion pro cess, were car ried out and are reported in this pa per. A method for cast ing un bro ken poly-allyl-diglycol-car bon ate sheets sized 25 cm ´ 15 cm and of a thick ness be tween 500 µm and 800 µm was de vel oped. A lon ger poly mer iza tion pro cess also helps to in crease neu tron sen si tiv ity, re duce the min i mum de tection limit and in crease the sig nal-to-noise ra tio of the de tec tor. The study sug gests that it is pos si ble to de velop in dig e nous poly-allyl-diglycol-car bon ate de tec tors with a min i mum detec tion limit of 0.1 mSv and sig nal-to-noise ra tio of 8.0.

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“…This tech nique is known as the com bined etch ing technique (CPE+ECE). It re moves the su per fi cial shal low de fects which may pro duce back ground tracks and is stan dard ized [23].…”

Section: Etch Ing Tech Niquesmentioning

confidence: 99%