2010 International Conference on Systems in Medicine and Biology 2010
DOI: 10.1109/icsmb.2010.5735356
|View full text |Cite
|
Sign up to set email alerts
|

Reduction in buckling of deposited thin film on PDMS elastomer by engineering the substrate topology

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2018
2018
2018
2018

Publication Types

Select...
1

Relationship

0
1

Authors

Journals

citations
Cited by 1 publication
(1 citation statement)
references
References 7 publications
0
1
0
Order By: Relevance
“…To produce robust conductive stamps, cyclo-olefin-copolymer (COC, TOPAS 8007, Advanced Polymers) is proposed as an alternative of the commonly used polydimethylsiloxane (PDMS). Indeed, depending on the metalization methods, gold films deposited on PDMS can show surface deformations, lack of adhesion, or loss of electrical conduction. , Especially in the case of patterns larger than 100 μm, submicron wrinkles (see Figure S1) appear on the PDMS surface, either in or out of the defined patterns, due to stress relaxation. When applied to e-μCP nanoxerography, these wrinkles prevent the stamp surface and the substrate from having an intimate contact between each other, which reduces the assembly density.…”
Section: Resultsmentioning
confidence: 99%
“…To produce robust conductive stamps, cyclo-olefin-copolymer (COC, TOPAS 8007, Advanced Polymers) is proposed as an alternative of the commonly used polydimethylsiloxane (PDMS). Indeed, depending on the metalization methods, gold films deposited on PDMS can show surface deformations, lack of adhesion, or loss of electrical conduction. , Especially in the case of patterns larger than 100 μm, submicron wrinkles (see Figure S1) appear on the PDMS surface, either in or out of the defined patterns, due to stress relaxation. When applied to e-μCP nanoxerography, these wrinkles prevent the stamp surface and the substrate from having an intimate contact between each other, which reduces the assembly density.…”
Section: Resultsmentioning
confidence: 99%