2014
DOI: 10.1016/j.applthermaleng.2014.04.028
|View full text |Cite
|
Sign up to set email alerts
|

Reducing thermal contact resistance using nanocoating

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1

Citation Types

0
3
0

Year Published

2016
2016
2024
2024

Publication Types

Select...
7
1

Relationship

0
8

Authors

Journals

citations
Cited by 17 publications
(4 citation statements)
references
References 20 publications
0
3
0
Order By: Relevance
“…Here, a silicon wafer with a 300 nm oxide insulating layer is used as the substrate, and an alumina-doped zinc oxide (AZO) film, [15] with stable chemical properties in air, is selected to be the thermoelectric film. To minimize the potential contact thermal resistance [16] between the substrate and the film, atomic layer deposition (ALD), with its inherent conformal coating characteristic [17] is chosen to deposit the thermoelectric film. Following that, we systematically scrutinize these models using a combination of FEA simulations and actual prototypes.…”
Section: Design Principle For T-psdmentioning
confidence: 99%
“…Here, a silicon wafer with a 300 nm oxide insulating layer is used as the substrate, and an alumina-doped zinc oxide (AZO) film, [15] with stable chemical properties in air, is selected to be the thermoelectric film. To minimize the potential contact thermal resistance [16] between the substrate and the film, atomic layer deposition (ALD), with its inherent conformal coating characteristic [17] is chosen to deposit the thermoelectric film. Following that, we systematically scrutinize these models using a combination of FEA simulations and actual prototypes.…”
Section: Design Principle For T-psdmentioning
confidence: 99%
“…Thermal contact conductance (TCC) is widely used in engineering applications such as machinery manufacturing, aircraft connection structures, ball bearings, low-temperature superconductivity and heat exchangers (Goodarzi et al , 2014; Kogut and Komvopoulos, 2003; Kogut and Komvopoulos, 2004). Many researchers have carried out a lot of research work and developed many prediction models to calculate the TCC of the joint surfaces.…”
Section: Introductionmentioning
confidence: 99%
“…TCR is one of the most critical parameters for the thermal analysis of materials. It affects applications with engineering devices that require a high heat flux [14,15], making it difficult to accurately manage the heat and cooling performance of many applications, such as those observed in the aeronautical industry, cryogenics, the nuclear industry, microelectronics, and space vehicles, among others [16][17][18].…”
Section: Introductionmentioning
confidence: 99%