Reducing the probe ball diameters of 3D silicon-based microprobes for dimensional metrology

Ferreira, N.M.; Brennecke, A.; Dietzel, Andreas; Büttgenbach, S.; Krah, Thomas; Metz, David; Kniel, Karin; Härtig, Frank

doi:10.1109/icsenst.2013.6727663

Cited by 10 publications

(32 citation statements)

References 13 publications

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“…In doing so, a thickness tolerance of about ±3 µm can be reached. [1,2] Stiffness S , S [N•mm ] b. Metal foil suspension 50 µm thick stainless steel foils (material: X5CrNi18-10 or AISI 304) were micro machined in a maskless ablation process by means of a femtosecond laser (microSTRUCTc, 3D Micromac AG equipped with a YB:KGW solid state laser, Pharos, Light Conversion) at 515 nm wavelength (frequency doubled).…”

Section: Manufacturing Processmentioning

confidence: 99%

“…In Figure 14, fully mounted single, double and steel/Si-membrane microprobes are shown. For the first mechanical characterization, these sensors were fixed on a PCB with adhesive and electrically contacted with conductive glue (Delo Dualbond IC343, Co. Delo) by a flip chip process to enable readout of the four Wheatstone bridges [1].…”

Section: Manufacturing Processmentioning

confidence: 99%

“…Microprobes are typically still integrated into specific, accurate and expensive µCMMs. However, measuring small structures with a high accuracy on more widely available conventional CMMs through microprobes that can be integrated is an advantageous alternative [1,2]. A tactile microprobe is typically a sensing device with an attached stylus.…”

Section: Introductionmentioning

confidence: 99%

“…In previous works [1], a silicon membrane based microprobe ( Figure 1) was developed. In the middle of the membrane, a boss structure is located, on which a tungsten carbide stylus with probe ball diameters between 50 μm and 300 μm is mounted (Figure 1a.).…”

Section: Introductionmentioning

confidence: 99%

“…When probing a sphere with a diameter of 2 mm, a slip up to 30 µm is observed at a nominal deflection of 20 µm in the sphere radius direction. [1].…”

Section: Introductionmentioning

confidence: 99%

See 4 more Smart Citations

3D piezoresistive silicon microprobes with stacked suspensions for tailored mechanical anisotropies

Metz

Ferreira

Dietzel

2017

Sensors and Actuators A: Physical

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Different kinds of piezoresistive microprobes based on silicon have been developed to enable measurement with high accuracies. However, the typical mechanical anisotropy of such systems leads to the slip of the tip, when probing inclined surfaces. Here, a novel microprobe design is presented, which can be tailored to provide a range of anisotropy or even a perfect isotropy. In the first approach, the microprobe is composed of two stacked silicon membranes. In the second approach, a stainless steel suspension in the form of a laser structured foil is stacked on a silicon membrane. Geometrical parameter studies were carried out by mechanical FEM simulations to determine their influence on the stiffnesses in all spatial directions and to predict anisotropies. Microsystems with selected geometries were fabricated and stacking was obtained through selective adhesive transfer and bonding on a wafer level. Prototypes with anisotropies between 3 and 0.4 were characterized confirming the simulations.Keywords -3D micro probing system, piezo-resistive effect, tactile coordinate measurement, laser structuring, wafer-level bonding and tailored mechanical anisotropy.I.

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Section: Manufacturing Processmentioning

confidence: 99%

Section: Manufacturing Processmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

“…When probing a sphere with a diameter of 2 mm, a slip up to 30 µm is observed at a nominal deflection of 20 µm in the sphere radius direction. [1].…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

3D piezoresistive silicon microprobes with stacked suspensions for tailored mechanical anisotropies

Metz

Ferreira

Dietzel

2017

Sensors and Actuators A: Physical

Self Cite

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Coordinate Measurement on Wafer Level – From Single Sensors to Sensor Arrays

Krah

Wedmann

Kniel

et al. 2015

Smart Sensors, Measurement and Instrumentation

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Integration of a piezoresistive microprobe into a commercial gear measuring instrument

Metz

Ferreira

Chaillot

et al. 2019

Precision Engineering

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Various microprobes have been developed in the last decade to address the needs of micrometrology. However, most microprobes are only employed in specialized measuring machines located in a few research institutes and are not widespread in the industry. This work aims to extend the capabilities of conventional coordinate measuring machines (CMMs) towards measuring microgeometries through the low-cost integration of a tactile microprobe. In order to demonstrate this, a gear measuring instrument (GMI), which is a commercial CMM not specialized for measurements at the microscale, has been equipped with a recently developed silicon-membrane-based microprobe. In the first part of this work, the working principle of the microprobe, its assembly and its integration into the GMI are described. Two different mounting setups of the microprobe onto the GMI were evaluated and tested. Measurements on the GMI were performed solely with the microprobe or by combining the microprobe and the measurement system already present on the GMI. This combination makes it possible to use the microprobe advantageously and to exchange it in a comfortable semi-automatic way. To test these two mounting setups, a new involute scanning artifact (SAFT) with superimposed waviness was measured.

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Reducing the probe ball diameters of 3D silicon-based microprobes for dimensional metrology

Cited by 10 publications

References 13 publications

3D piezoresistive silicon microprobes with stacked suspensions for tailored mechanical anisotropies

3D piezoresistive silicon microprobes with stacked suspensions for tailored mechanical anisotropies

Coordinate Measurement on Wafer Level – From Single Sensors to Sensor Arrays

Integration of a piezoresistive microprobe into a commercial gear measuring instrument

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