Reducing Subsurface Damage with Trizact™ Diamond Tile During a Prime Silicon Wafer Grinding Process

Gagliardi, John J.; Romero, Vincent D.; Stolzenburg, F.; Rosenflanz, Anatoly; Anderson, Jason D.

doi:10.1007/s11664-023-10326-9

J. Electron. Mater.

2023

DOI: 10.1007/s11664-023-10326-9

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Reducing Subsurface Damage with Trizact™ Diamond Tile During a Prime Silicon Wafer Grinding Process

John J. Gagliardi¹,

Vincent D. Romero²,

F. Stolzenburg³

et al.

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Reducing Subsurface Damage with Trizact™ Diamond Tile During a Prime Silicon Wafer Grinding Process

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References 13 publications

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