Reducing Migration of Sintered Ag for Power Devices Operating at High Temperature

Li, Dan; Mei, Yunhui; Xin, Yunchang; Li, Zhiqiao; Chu, Paul K.; Ma, Changsheng; Lu, Guo-Quan

doi:10.1109/tpel.2020.2994343

Cited by 17 publications

(5 citation statements)

References 18 publications

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“…It should be noted that the shear strength of the Ag-SiO x paste drops to less than 30 MPa after 600 cycles, but the shear strength of the nano-Ag control samples remains ~30 MPa after 1000 cycles. It was likely that the atomic diffusion rate of Ag into Ag, i.e., ~1.455 × 10 −23 m 2 /s [20], is much higher than that of Ag into SiO x , i.e., ~8.76 × 10 −29 m 2 /s [21], resulting in an insufficient driving force for the sinter-bonding of Ag-SiO x heterogeneous particles under the same pressure-free and sintering temperature conditions [22]. The Young's modulus of the SiO x nanoparticles, on the other hand, is much higher than that of the Ag nanoparticles, and the thermal expansion coefficient is much lower than that of the sintered nano-Ag, so the interfacial bonds of the sintered Ag-SiO x were subjected to thermo-mechanical stress fatigue during temperature cycling, eventually leading to its shear strength dropping faster in the case of pressureless sintering [23].…”

Section: Resultsmentioning

confidence: 99%

A Reliable Way to Improve Electrochemical Migration (ECM) Resistance of Nanosilver Paste as a Bonding Material

Ding

Wang²,

Zhang

et al. 2022

Applied Sciences

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Electrochemical migration (ECM) of sintered nano-Ag could be a serious reliability concern for power devices with high-density packaging. An anti-ECM nano-Ag-SiOx paste was proposed by doping 0.1wt% SiOx nanoparticles rather than previously used expensive noble metals, e.g., palladium. The ECM lifetime of the sintered nano-Ag-SiOx was 1.5 to 3 times longer than that of the sintered nano-Ag, due to the fact that the SiOx could protect the Ag from oxidation. The thermo-mechanical reliability of the sintered nano-Ag-SiOx was also improved by sintering under 5 MPa assisted pressure. The lesser porosity and smaller grain boundaries of the sintered nano-Ag-SiOx could also be beneficial to retard the silver ECM. In the end, a double-sided semiconductor device was demonstrated to validate the better resistance to the ECM using the sintered nano-Ag-SiOx.

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Section: Resultsmentioning

confidence: 99%

A Reliable Way to Improve Electrochemical Migration (ECM) Resistance of Nanosilver Paste as a Bonding Material

Ding

Wang²,

Zhang

et al. 2022

Applied Sciences

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“…However, the high cost of Ag poses significant challenges from a commercial standpoint, and it has a weak resistance to electromigration. [37][38][39] Therefore, ongoing research explores alternative metals such as copper (Cu), nickel (Ni), and tin (Sn) as substitutes for Ag NPs. [31,[37][38][39][40] Cu has emerged as a promising alternative due to its relatively low cost and high conductivity compared to Ag.…”

Section: Introductionmentioning

confidence: 99%

“…[37][38][39] Therefore, ongoing research explores alternative metals such as copper (Cu), nickel (Ni), and tin (Sn) as substitutes for Ag NPs. [31,[37][38][39][40] Cu has emerged as a promising alternative due to its relatively low cost and high conductivity compared to Ag. Additionally, Cu NPs have gained considerable attention for their beneficial catalytic, optical, and electrical properties.…”

Section: Introductionmentioning

confidence: 99%

A Comparative Study of Single and Dual Sintering Processes of Metal Nanoparticles for Flexible Electronics Application

Chowdhury,

Werther,

Young

et al. 2024

Adv Eng Mater

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The introduction of metallic nanoparticles (NPs) has revolutionized the fabrication of flexible electronic devices. Metallic NPs have numerous applications in the electronics industry due to their unique shape and size‐dependent properties compared to their bulk counterparts. However, the application of metallic NPs requires additional post‐processing procedures to remove stabilizing agents and additives, to achieve superior electrical conductivity. In this study, the sintering of printed metal NP patterns, including silver (Ag) and copper (Cu) NPs, fabricated on flexible polyimide substrates is explored using single and dual sintering methods. The single sintering methods involve exposing the printed metal NPs to either laser irradiation or thermal treatment. In the case of the dual sintering methods, one approach is to subject the printed metal patterns to thermal treatment followed by laser irradiation, while the other approach involves exposing the printed metal patterns to laser irradiation followed by thermal treatment. Moreover, this study identifies and compares the effects of these various sintering methods on the physical, electrical, chemical, and mechanical properties of the Ag and Cu NP patterns. Finally, the study suggests that dual sintering methods are more effective in improving the electrical conductivity and mechanical properties of the NP patterns under optimized sintering conditions.This article is protected by copyright. All rights reserved.

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“…However, with an increase in the filler content, the mechanical bonding strength of ECA composites will be compromised, and the raw materials cost will also increase . Furthermore, the electrochemical migration (ECM) of Ag-based ECAs is a well-known reliability issue, which could cause short circuiting between biased electrodes, particularly in the presence of moisture or in high-temperature environments. − Aiming at the emerging SiC/GaN power electronics packaging applications, it is highly desirable to develop ECA composite materials with high electrical conductivity, mechanical strength, and electrochemical migration resistance as well as at relatively low cost. − …”

Section: Introductionmentioning

confidence: 99%

Size-Controlled Low-Melting-Point-Alloy Particle-Incorporated Transient Liquid-Phase Epoxy Composite Conductive Adhesive with High Performances

Yang

Liu

Zhang

et al. 2023

ACS Appl. Polym. Mater.

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With fast developments in the environmental-friendly industry, electrically conductive adhesive (ECA) composites with high electrical conductivity, mechanical strength, and electrochemical migration resistance as well as low cost are highly desirable for emerging power electronics applications. In this study, a category of ECAs, namely, size-controllable sonochemical low-melting-point-alloy (LMPA) particle-incorporated transient liquid-phase ECAs (TLP-ECAs), with excellent electrical conductivity, considerable mechanical strength, and high electrochemical migration resistance has been successfully demonstrated. Experimental results showed that the bulk resistivity of TLP-ECA decreased to a minimum value of 2.37 × 10–4 Ω-cm with the remaining filler content at a low level (the total content of metallic fillers, i.e., 70 wt % in TLP-ECAs), while the mechanical shear strength increased considerably (by 55.4%) compared with pure silver ECA with the same filler content, demonstrating that addition of sonochemical LMPA particles into ECA can simultaneously and considerably improve the electrical and mechanical properties. Moreover, the diffusional reaction mechanism of sonochemical LMPA particle-filled TLP-ECA was systematically investigated via differential scanning calorimetry (DSC), X-ray diffraction (XRD), and high-resolution scanning transmission electron microscopy in high-resolution high-angle annular dark-field mode (STEM-HAADF). The mechanism of the diffusion reaction of TLP-ECA with LMPA particles was rationalized, where Ag9In4 (γ phase, cP52, and P43m) and Ag3Sn (ε phase, oP8, and Pmmm) intermetallic compounds (IMC) and their corresponding nanostructures were responsible for the substantial enhancement in mechanical strength and the antielectrochemical migration property. The sonochemical method is the key to synthesize LMPA particles of desirable compositions and controllable size, thereby enhancing the overall performance of Ag-based TLP-ECAs. Accordingly, the sonochemical LMPA particle-incorporated-TLP-ECAs are the promising interconnection material candidates for power electronics packaging.

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Reducing Migration of Sintered Ag for Power Devices Operating at High Temperature

Cited by 17 publications

References 18 publications

A Reliable Way to Improve Electrochemical Migration (ECM) Resistance of Nanosilver Paste as a Bonding Material

A Reliable Way to Improve Electrochemical Migration (ECM) Resistance of Nanosilver Paste as a Bonding Material

A Comparative Study of Single and Dual Sintering Processes of Metal Nanoparticles for Flexible Electronics Application

Size-Controlled Low-Melting-Point-Alloy Particle-Incorporated Transient Liquid-Phase Epoxy Composite Conductive Adhesive with High Performances

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