Reducing Migration of Sintered Ag for Power Devices Operating at High Temperature

Li, Dan; Mei, Yunhui; Xin, Yunchang; Li, Zhiqiao; Chu, Paul K.; Ma, Changsheng; Lu, Guo-Quan

doi:10.1109/tpel.2020.2994343

Cited by 16 publications

(2 citation statements)

References 18 publications

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“…However, with an increase in the filler content, the mechanical bonding strength of ECA composites will be compromised, and the raw materials cost will also increase . Furthermore, the electrochemical migration (ECM) of Ag-based ECAs is a well-known reliability issue, which could cause short circuiting between biased electrodes, particularly in the presence of moisture or in high-temperature environments. − Aiming at the emerging SiC/GaN power electronics packaging applications, it is highly desirable to develop ECA composite materials with high electrical conductivity, mechanical strength, and electrochemical migration resistance as well as at relatively low cost. − …”

Section: Introductionmentioning

confidence: 99%

Size-Controlled Low-Melting-Point-Alloy Particle-Incorporated Transient Liquid-Phase Epoxy Composite Conductive Adhesive with High Performances

Yang

Liu

Zhang

et al. 2023

ACS Appl. Polym. Mater.

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With fast developments in the environmental-friendly industry, electrically conductive adhesive (ECA) composites with high electrical conductivity, mechanical strength, and electrochemical migration resistance as well as low cost are highly desirable for emerging power electronics applications. In this study, a category of ECAs, namely, size-controllable sonochemical low-melting-point-alloy (LMPA) particle-incorporated transient liquid-phase ECAs (TLP-ECAs), with excellent electrical conductivity, considerable mechanical strength, and high electrochemical migration resistance has been successfully demonstrated. Experimental results showed that the bulk resistivity of TLP-ECA decreased to a minimum value of 2.37 × 10–4 Ω-cm with the remaining filler content at a low level (the total content of metallic fillers, i.e., 70 wt % in TLP-ECAs), while the mechanical shear strength increased considerably (by 55.4%) compared with pure silver ECA with the same filler content, demonstrating that addition of sonochemical LMPA particles into ECA can simultaneously and considerably improve the electrical and mechanical properties. Moreover, the diffusional reaction mechanism of sonochemical LMPA particle-filled TLP-ECA was systematically investigated via differential scanning calorimetry (DSC), X-ray diffraction (XRD), and high-resolution scanning transmission electron microscopy in high-resolution high-angle annular dark-field mode (STEM-HAADF). The mechanism of the diffusion reaction of TLP-ECA with LMPA particles was rationalized, where Ag9In4 (γ phase, cP52, and P43m) and Ag3Sn (ε phase, oP8, and Pmmm) intermetallic compounds (IMC) and their corresponding nanostructures were responsible for the substantial enhancement in mechanical strength and the antielectrochemical migration property. The sonochemical method is the key to synthesize LMPA particles of desirable compositions and controllable size, thereby enhancing the overall performance of Ag-based TLP-ECAs. Accordingly, the sonochemical LMPA particle-incorporated-TLP-ECAs are the promising interconnection material candidates for power electronics packaging.

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Section: Introductionmentioning

confidence: 99%

Size-Controlled Low-Melting-Point-Alloy Particle-Incorporated Transient Liquid-Phase Epoxy Composite Conductive Adhesive with High Performances

Yang

Liu

Zhang

et al. 2023

ACS Appl. Polym. Mater.

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“…There has been extensive research in the synthesis and processing of Ag. However, due to various drawbacks related to the use of Ag, including its expensive cost (∼800 USD kg −1 ) and weak resistance to electromigration, the demand for alternative materials is increasing [17][18][19][20][21]. Copper (Cu) should be considered a promising material to substitute for Ag.…”

Section: Introductionmentioning

confidence: 99%

Effect of dual sintering with laser irradiation and thermal treatment on printed copper nanoparticle patterns

Chowdhury,

Young,

Poche

et al. 2023

Nanotechnology

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The dual sintering of copper (Cu) nanoparticles (NPs) was introduced to produce conductive patterns suitable for flexible electronics applications. In this method, laser irradiation using a Nd:YAG laser with a wavelength of 1064 nm was performed at laser powers of 400, 600, and 800 mJ. The laser irradiation time was 15 and 30 s for each laser power. After laser irradiation, all of the Cu NP patterns were thermally sintered under formic acid (FA) vapors. The temperature and time for thermal sintering were selected as 260 °C and 15 min, respectively. The resultant physical, chemical, electrical and mechanical properties were evaluated and compared considering the six different dual sintering conditions. The Cu NP patterns sintered using 800 mJ for 30 s showed increased necking and coalescence compared to the other patterns and featured a microstructure with increased density. Despite being oxidized, the Cu NP patterns sintered with 800 mJ for 30 s showed the lowest electrical resistivity of 11.25 μΩ·cm. The surface of every sintered Cu pattern was oxidized, and mechanical hardness increased with increasing laser power. The Cu NP pattern sintered with 800 mJ for 30 s demonstrated the highest hardness of 48.64 N/mm2. After sintering using the six different conditions, the Cu NP patterns exhibited a weight loss of 0.02-3.87 wt%, and their roughness varied in the range of 26.15-74.08 nm. This can be attributed to the effective removal of organic residues and the degree of particle agglomeration. After performing folding tests up to 50 cycles, Cu NP patterns showed an upward trend in resistance with increasing laser power and time. The highest and lowest resistance ratios were observed as 3.97 and 17.24 for the patterns sintered at 400 mJ for 15 s and 800 mJ for 30 s, respectively.

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A Comparative Study of Single and Dual Sintering Processes of Metal Nanoparticles for Flexible Electronics Application

Chowdhury,

Werther,

Young

et al. 2024

Adv Eng Mater

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The introduction of metallic nanoparticles (NPs) has revolutionized the fabrication of flexible electronic devices. Metallic NPs have numerous applications in the electronics industry due to their unique shape and size‐dependent properties compared to their bulk counterparts. However, the application of metallic NPs requires additional post‐processing procedures to remove stabilizing agents and additives, to achieve superior electrical conductivity. In this study, the sintering of printed metal NP patterns, including silver (Ag) and copper (Cu) NPs, fabricated on flexible polyimide substrates is explored using single and dual sintering methods. The single sintering methods involve exposing the printed metal NPs to either laser irradiation or thermal treatment. In the case of the dual sintering methods, one approach is to subject the printed metal patterns to thermal treatment followed by laser irradiation, while the other approach involves exposing the printed metal patterns to laser irradiation followed by thermal treatment. Moreover, this study identifies and compares the effects of these various sintering methods on the physical, electrical, chemical, and mechanical properties of the Ag and Cu NP patterns. Finally, the study suggests that dual sintering methods are more effective in improving the electrical conductivity and mechanical properties of the NP patterns under optimized sintering conditions.This article is protected by copyright. All rights reserved.

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Reducing Migration of Sintered Ag for Power Devices Operating at High Temperature

Cited by 16 publications

References 18 publications

Size-Controlled Low-Melting-Point-Alloy Particle-Incorporated Transient Liquid-Phase Epoxy Composite Conductive Adhesive with High Performances

Size-Controlled Low-Melting-Point-Alloy Particle-Incorporated Transient Liquid-Phase Epoxy Composite Conductive Adhesive with High Performances

Effect of dual sintering with laser irradiation and thermal treatment on printed copper nanoparticle patterns

A Comparative Study of Single and Dual Sintering Processes of Metal Nanoparticles for Flexible Electronics Application

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