Reduced Pressure – Chemical Vapor Deposition of Monocrystalline and Polycrystalline Si(:B) and SiGe(:B) Layers on Blanket Wafers

Abstract

In this paper, epitaxial growths or depositions were performed, in 300 mm RP-CVD chambers, on two types of templates: N-type Si substrates or poly-Si/oxide/ P-type Si substrates. SiH4+HCl+H2 and SiH2Cl2+HCl+GeH4+H2 chemistries were used to deposit Si and SiGe layers between 675-750°C and 10-20 Torr on such wafers. Monocrystalline and polycrystalline growth kinetics were similar for intrinsic SiGe. Meanwhile, growth kinetics and boron incorporation were different for mono-Si:B, mono-SiGe:B, poly-Si:B and poly-SiGe:B layers. While the impact of B atoms is well documented in monocrystalline layers, it is still poorly understood for polycrystalline layers. An attempt has therefore been made to quantify it by measuring the poly-structure, with a focus on the poly-grains size and the number of grain boundaries. A lattice contraction coefficient β = - 9.82 * 10-24 cm3 has otherwise been extracted from an in-depth study of the incorporation of B atoms into substitutional sites of the SiGe epitaxial lattice.