Redox reaction in a Mg/Nb2O5 nanocomposite processed by high-pressure torsion

Caires, Anderson J.; Castro, Mirian Cabral Moreira de; Montoro, Luciano A.; Isaac, Augusta; Figueiredo, Roberto B.

doi:10.1016/j.matlet.2021.130418

Cited by 2 publications

(1 citation statement)

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“…Although EK techniques such as EP and DEP are able to form densely packed layers of colloidal particles, there is little control in the particle packing order within these layers, highlighting a major area of improvement [67][68][69][70][71][72]. The combination of multiple EK techniques within the same system has allowed higher control, resulting in the patterning of colloidal particles into advanced structures [51,58,64].…”

Section: Hybrid Systems Employed For the Patterning Of Colloidsmentioning

confidence: 99%

Electropatterning—Contemporary developments for selective particle arrangements employing electrokinetics

et al. 2023

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The selective positioning and arrangement of distinct types of multiscale particles can be used in numerous applications in microfluidics, including integrated circuits, sensors and biochips. Electrokinetic (EK) techniques offer an extensive range of options for label‐free manipulation and patterning of colloidal particles by exploiting the intrinsic electrical properties of the target of interest. EK‐based techniques have been widely implemented in many recent studies, and various methodologies and microfluidic device designs have been developed to achieve patterning two‐ and three‐dimensional (3D) patterned structures. This review provides an overview of the progress in electropatterning research during the last 5 years in the microfluidics arena. This article discusses the advances in the electropatterning of colloids, droplets, synthetic particles, cells, and gels. Each subsection analyzes the manipulation of the particles of interest via EK techniques such as electrophoresis and dielectrophoresis. The conclusions summarize recent advances and provide an outlook on the future of electropatterning in various fields of application, especially those with 3D arrangements as their end goal.

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