Redetermination of the crystal structure of the Ag<sub>3</sub>Sn intermetallic compound

Rossi, Paul; Zotov, Ν.; Mittemeijer, E. J.

doi:10.1515/zkri-2015-1867

Cited by 16 publications

(10 citation statements)

References 15 publications

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“…To explore the active mechanisms and resulting growth microstructures, analytical scanning electron microscopy (SEM) was performed in a Zeiss AURIGA field-emission gun-SEM (Carl Zeiss, Oberkochen, Germany) equipped with an Oxford Instruments INCA x-sight energy dispersive x-ray (EDX) detector (Oxford Instruments, Oxfordshire, UK) and an e-Flash Bruker electron backscatter diffraction (EBSD) detector (Bruker AXS Inc., Fitchburg, WI). Each IMC has been identified by detailed XRD studies previously [35][36][37][38][39][40][41][42] and were confirmed here by combining EDX with EBSD. The crystal structures used for EBSD indexing are summarised in Table 1.…”

Section: Accepted Manuscriptsupporting

confidence: 66%

Nucleation and twinning in tin droplet solidification on single crystal intermetallic compounds

Xian

Belyakov

et al. 2018

Acta Materialia

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βSn nucleation is a key step in the formation of microstructure in electronic solder joints. Here, the heterogeneous nucleation of βSn is studied in undercooled tin droplets spread on the facets of various intermetallic compounds (IMCs). Nucleation undercoolings are measured in solidifying droplets and are linked to orientation relationships (ORs) measured by electron backscatter diffraction (EBSD). Preferred ORs developed on all IMCs studied. For the more potent nucleants (αCoSn 3 , IrSn 4 , PtSn 4 , PdSn 4) the ORs represent relatively simple atomic matches. ORs with lower potency nucleants (Cu 6 Sn 5 , Ag 3 Sn, Ni 3 Sn 4) had more complex atomic matches that are explored based on matching of the closest packed atomic rows. βSn solidification twinning is shown to be more complex than has been reported previously: both nucleation on an IMC facet and cyclic twinning of that grain occurred in many droplets on Cu 6 Sn 5 , Ag 3 Sn, Ni 3 Sn 4 ; in all twinned droplets the <100> Sn twinning axis occurred along a direction on the IMC with the lowest linear atomic disregistry; and interrelated cyclic twins formed consisting of up to five rings of cyclic twins all related by shared <100> Sn axes.

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Section: Accepted Manuscriptsupporting

confidence: 66%

Nucleation and twinning in tin droplet solidification on single crystal intermetallic compounds

Xian

Belyakov

et al. 2018

Acta Materialia

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“…Rietveld refinement and that of Rossi et al [30] was confirmed: for example, the (022) peak shown in SI- Figure 1 could not be satisfactorily fit by the other structures.…”

Section: Rietveld Refinementmentioning

confidence: 80%

“…The model structures that were refined were taken from the following references: Ni3Sn4 [29], Ag3Sn [30], mS44-'Cu6Sn5 [31], Cu6Sn5 [32,33], oS80-Cu3Sn [34] and Sn [35].…”

Section: Cte Determinationmentioning

confidence: 99%

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Anisotropic thermal expansion of Ni 3 Sn 4 , Ag 3 Sn, Cu 3 Sn, Cu 6 Sn 5 and βSn

et al. 2017

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The directional coefficient of thermal expansion (CTE) of intermetallics in electronic interconnections is a key thermophysical property that is required for microstructurelevel modelling of solder joint reliability. Here, CTE ellipsoids are measured for key solder intermetallics using synchrotron x-ray diffraction (XRD). The role of the crystal structure used for refinement on the CTE shape and temperature dependence is investigated. The results are used to discuss the Sn-IMC orientation relationships (ORs) that minimise the in-plane CTE mismatch on IMC growth facets, which are measured with electron backscatter diffraction (EBSD) in solder joints on Cu and Ni substrates. The CTE mismatch in fully-intermetallic joints is discussed, and the relationship between the directional CTE of monoclinic and hexagonal polymorphs of Cu6Sn5 is explored.

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“…The solidification goes along with the formation of a number of intermetallic phases. The most important in the resulting metal matrix composite are Ag 2 Hg 3 [4] as the major matrix phase, Ag 3 Sn [4,5] as the mechanically strongest phase, Sn 8 Hg [6] as the most corrosive phase, Ag 5 Sn [7], Cu 6 Sn 5 and Cu 3 Sn [8][9][10], amongst others [11,12]. The γ2-phase Sn 8 Hg is posing a major problem as it is relatively corrosive and leads to degradation of the filling over the years, especially at the tooth-amalgam interface.…”

Section: Introductionmentioning

confidence: 99%

Stuck in Our Teeth? Crystal Structure of a New Copper Amalgam, Cu3Hg

2017

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Abstract:We have synthesized a new Cu amalgam, the Cu-rich phase Cu 3 Hg. It crystallizes with the Ni 3 Sn structure type with a hexagonal unit cell (space group P6 3 /mmc , a = 5.408(4) Å, c = 4.390(3) Å) and shows some mixed occupancy of Cu on the Hg site, resulting in a refined composition of Cu 3.11 Hg 0.89 . This is the first example of an amalgam with the Ni 3 Sn structure type where Hg is located mainly on the Sn site. Cu 3 Hg might be one of the phases constituting dental amalgams and therefore has major relevance, as well as the only Cu amalgam phase described so far, Cu 7 Hg 6 with the γ-brass structure. It occurs as a biphase in our samples. Thermal decomposition of Cu amalgam samples in a dynamic vacuum yields nanostructured copper networks, possibly suitable for catalytic applications.

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Redetermination of the crystal structure of the Ag₃Sn intermetallic compound

Abstract: Ambiguity exists in the literature on the crystal structure of Ag

Cited by 16 publications

References 15 publications

Nucleation and twinning in tin droplet solidification on single crystal intermetallic compounds

Nucleation and twinning in tin droplet solidification on single crystal intermetallic compounds

Anisotropic thermal expansion of Ni 3 Sn 4 , Ag 3 Sn, Cu 3 Sn, Cu 6 Sn 5 and βSn

Stuck in Our Teeth? Crystal Structure of a New Copper Amalgam, Cu3Hg

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Redetermination of the crystal structure of the Ag3Sn intermetallic compound

Abstract: Ambiguity exists in the literature on the crystal structure of Ag

Cited by 16 publications

References 15 publications

Nucleation and twinning in tin droplet solidification on single crystal intermetallic compounds

Nucleation and twinning in tin droplet solidification on single crystal intermetallic compounds

Anisotropic thermal expansion of Ni 3 Sn 4 , Ag 3 Sn, Cu 3 Sn, Cu 6 Sn 5 and βSn

Stuck in Our Teeth? Crystal Structure of a New Copper Amalgam, Cu3Hg

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Redetermination of the crystal structure of the Ag₃Sn intermetallic compound