2011
DOI: 10.1016/j.wasman.2011.07.006
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Recycling of WEEE: Characterization of spent printed circuit boards from mobile phones and computers

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Cited by 341 publications
(164 citation statements)
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References 21 publications
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“…Plastics are used in many applications (Bashir, 2013) because of their versatility, light weight and also easy to manufacture (Andrady & Neal, 2009). Plastics are used extensively in automobiles (Gerrard & Kandlikar, 2007;Mazzanti & Zoboli, 2006;Smink, 2007), building and constructions (Cleetus, Thomas, & Varghese, 2013), packaging (Al-Salem, Lettieri, & Baeyens, 2009), bags (Bashir, 2013) and phones (Kasper et al, 2011;Yamane, de Moraes, Espinosa, & Tenório, 2011) and computers (Balakrishnan, Anand, & Chiya, 2007;Guo, Guo, & Xu, 2009;Hall & Williams, 2007). As a consequence, the production of plastics has increased substantially over the last 60 years .…”
Section: The Waste Plastic Situationmentioning
confidence: 99%
“…Plastics are used in many applications (Bashir, 2013) because of their versatility, light weight and also easy to manufacture (Andrady & Neal, 2009). Plastics are used extensively in automobiles (Gerrard & Kandlikar, 2007;Mazzanti & Zoboli, 2006;Smink, 2007), building and constructions (Cleetus, Thomas, & Varghese, 2013), packaging (Al-Salem, Lettieri, & Baeyens, 2009), bags (Bashir, 2013) and phones (Kasper et al, 2011;Yamane, de Moraes, Espinosa, & Tenório, 2011) and computers (Balakrishnan, Anand, & Chiya, 2007;Guo, Guo, & Xu, 2009;Hall & Williams, 2007). As a consequence, the production of plastics has increased substantially over the last 60 years .…”
Section: The Waste Plastic Situationmentioning
confidence: 99%
“…The contamination based on organic or halogen-containing compounds represents a common problem which remains at the center of investigation concerning recovery methods. Due to the elevated amount of copper as well as precious metals, this area will gain further importance in the near future [18,21].…”
Section: Residues From the Copper Industrymentioning
confidence: 99%
“…No processamento físico, foi utilizado o moinho de facas (marca Rone, modelo FA2305) com grelha de 9 mm, seguido de moagem em moinho de martelos (marca Astecma, modelo MDM 18/18) com grelha de 2 mm, tendo como finalidade a redução do tamanho, aumento da área superficial e liberação dos materiais das placas de circuito impresso, facilitando a recuperação de metais [22]. Após a moagem foi feito o quarteamento, visando melhor homogeneização das amostras, até obtenção de frações de 20 g. As camadas que podem ser de cobre aparecem de forma pontilhada, não contínua, e representam as trilhas dos circuitos que não são paralelas a seção transversal da amostra analisada, muito comuns em PCIs.…”
Section: Cominuiçãounclassified