2010
DOI: 10.1016/s1003-6326(10)60547-x
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Recycling of AZ91 Mg alloy through consolidation of machined chips by extrusion and ECAP

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Cited by 53 publications
(19 citation statements)
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“…In addition, recycling processes based on other SPD methods such as cyclic extrusion compression (CEC) [16], equal channel angular pressing (ECAP) [17][18][19], high-pressure torsion (HPT) [20] or compressive torsion [21], and combined use of forward extrusion and ECAP [22,23] have also been reported. Recently, another study [24] aimed at producing a composite material including nano-particles from machining chips via hot extrusion, and a new method was proposed to produce clad plates from iron chips by using hot rolling [25].…”
Section: Introductionmentioning
confidence: 99%
“…In addition, recycling processes based on other SPD methods such as cyclic extrusion compression (CEC) [16], equal channel angular pressing (ECAP) [17][18][19], high-pressure torsion (HPT) [20] or compressive torsion [21], and combined use of forward extrusion and ECAP [22,23] have also been reported. Recently, another study [24] aimed at producing a composite material including nano-particles from machining chips via hot extrusion, and a new method was proposed to produce clad plates from iron chips by using hot rolling [25].…”
Section: Introductionmentioning
confidence: 99%
“…There were only a few papers where combination of extrusion and ECAP process was investigated. Ying et al [18] investigated solid state recycling of AZ91 Mg alloy utilizing combination of the hot extrusion and afterwards one ECAP pass on 300 • C. After ECAP on elevated temperatures, crystal grains were refined inside recycled specimens. Furthermore, interfaces of the chips disappear after extrusion and after ECAP, which indicates the improvement of the bonding between chips [18].…”
mentioning
confidence: 99%
“…Ying et al [18] investigated solid state recycling of AZ91 Mg alloy utilizing combination of the hot extrusion and afterwards one ECAP pass on 300 • C. After ECAP on elevated temperatures, crystal grains were refined inside recycled specimens. Furthermore, interfaces of the chips disappear after extrusion and after ECAP, which indicates the improvement of the bonding between chips [18]. Krolo et al [19] utilized a combination of the direct hot extrusion and ECAP at different temperatures to investigate the influence of SSR process parameters on recycled samples microhardness and electrical conductivity.…”
mentioning
confidence: 99%
“…To a continuous process forward fit is possible to implement a number of methods such as equal channel angular pressing (ECAP) [7][8][9][10][11][12][13][14], twist extrusion (TE) [15][16][17], or friction stir processing called as KOBO [18,19]. Authors [6,20] achieved superior bonding quality of chip-based extrudates byintegrated aluminum extrusion and equal channel angular pressing (iECAP) at the low extrusion ratio of ~8.7: first Well properties are achieved by extruding through feeder porthole die, with two or four feeder [4][5][6]21]. Authors [4] reported that for the welding of the chips two criterions must be fulfilled.…”
Section: Introductionmentioning
confidence: 99%