Recrystallization of pure copper investigated by calorimetry and microhardness

Thermal conductivity in yttria dispersed copper

“…This temperature is in approximate agreement with the values observed elsewhere [12,13]. Although, the stored energy levels are not quantified in the present study, its intensity is much smaller when compared to the other FSPed samples which is concomitant with the fact that a heavily deformed material has more stored energy and will recrystallize more rapidly than a coarse grained material [6,10,12,14]. Which also explains the reduction of the onset temperature from 170°C for pure copper to the 137-140°C in the FSPed samples.…”

“…Copper is a natural choice thanks to its high thermal conductivity, low elastic modulus which reduces the thermal stresses, which are necessary characteristics of an actively cooled component. However, copper suffers from a large Coefficient of Thermal Expansion (CTE) and a reduction in high temperature strength as a result of recrystallization [6][7][8]. Hence, limiting the thermal expansion of copper is highly desirable as a first step to increase its applicability for thermal management applications.…”

Simulation of CP-Ti Recrystallization and Grain Growth by a Cellular Automata Algorithm: Simulated Versus Experimental Results

“…A typical situation in which this adaptation can be tested is the simulation of differential scanning calorimetry (DSC) experiments. Such experiments can be performed to detect the occurrence of primary recrystallization, determine the material recrystallization temperature and evaluate the activation energy involved in 7±1 8±1 10±1 8±1 10±1 15±1 13±1 20±1 27±1 Experimental 21 5±2 8±2 13±2 8±2 11±2 18±2 11±2 14±2 22±2 the process 28 . Figure 9 illustrates the results for the simulation of the primary recrystallization kinetics occurring at heating rates of 5, 15 and 25 K/min.…”

The Influence of Mg Additive on the Structure and Electrical Conductivity of Pure Copper Castings

“…The presence of such impurities is highly undesirable because of the lower strength properties due to decreases in the area of the cross section [14,15] as well as reductions in the thermoelectrical and technological properties [3,16,17]. Moreover, the presence of inclusions, impurities and porosities in ingots leads to defects in components during plastic deformation of pure copper and has been extensively investigated by many researchers [18][19][20][21][22][23][24][25].…”