Conference Record of the Twenty Fifth IEEE Photovoltaic Specialists Conference - 1996 1996
DOI: 10.1109/pvsc.1996.564031
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Record low surface recombination velocities on low-resistivity silicon solar cell substrates

Abstract: In this paper, the lowest ever reported effective surface recombination velocities Seff on typical p-type low-resistivity silicon solar cell substrates are presented. We obtain this surface passivation by means of remote plasma silicon nitride films fabricated at 375°C. On polished as well as on chemically textured silicon surfaces, the applied low-temperature passivation scheme is significantly superior to high-temperature passivation by state-of-the-art thermal oxides. On polished 1.5-Qcm p-Si wafers, an ext… Show more

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Cited by 25 publications
(21 citation statements)
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“…5,33,7 PECVD silicon nitride films can be very effective for surface passivation, with record low values of surface recombination velocity of 4 cm/s being reported. 34 Alas, the best passivating nitride films are those with a high silicon content, closer to the SiN x #5 film, which we have discovered is too absorbing to be an effective AR coating. There are some reports of good passivation with silicon-poor SiN x films, 35 but the authors concede that the film suffers from a poor thermal stability and that the conditions required to grow the film are difficult to optimize.…”
Section: Surface Passivation Considerationsmentioning
confidence: 83%
“…5,33,7 PECVD silicon nitride films can be very effective for surface passivation, with record low values of surface recombination velocity of 4 cm/s being reported. 34 Alas, the best passivating nitride films are those with a high silicon content, closer to the SiN x #5 film, which we have discovered is too absorbing to be an effective AR coating. There are some reports of good passivation with silicon-poor SiN x films, 35 but the authors concede that the film suffers from a poor thermal stability and that the conditions required to grow the film are difficult to optimize.…”
Section: Surface Passivation Considerationsmentioning
confidence: 83%
“…• to 400 • C. Excellent surface recombination velocities of less than 10 cm/s have been reached [16]. An additional advantage of SiN x is the incorporation of hydrogen in this layer which could act as a bulk passivation source for multicrystalline silicon.…”
Section: Deposition Temperaturementioning
confidence: 97%
“…A detailed discussion of this dependence can be found in Ref. 28. According to Figure 12, the situation changes signi®cantly if a local BSF is included below the Al grid lines for reduced metal contact recombination.…”
Section: Bifacial N P Cellsmentioning
confidence: 98%
“…These results were obtained from MW-PCD measurements using about half a sun of white bias light. 28 The electron diusion length of the starting material was about 2 mm. For the samples without a local BSF, the recombination losses occur predominantly at the metal contacts.…”
Section: Bifacial N P Cellsmentioning
confidence: 98%