Reconfigurable neuromorphic memristor network for ultralow-power smart textile electronics

Abstract

Neuromorphic computing memristors are attractive to construct low-power- consumption electronic textiles due to the intrinsic interwoven architecture and promising applications in wearable electronics. Developing reconfigurable fiber-based memristors is an efficient method to realize electronic textiles that capable of neuromorphic computing function. However, the previously reported artificial synapse and neuron need different materials and configurations, making it difficult to realize multiple functions in a single device. Herein, a textile memristor network of Ag/MoS2/HfAlOx/carbon nanotube with reconfigurable characteristics was reported, which can achieve both nonvolatile synaptic plasticity and volatile neuron functions. In addition, a single reconfigurable memristor can realize integrate-and-fire function, exhibiting significant advantages in reducing the complexity of neuron circuits. The firing energy consumption of fiber-based memristive neuron is 1.9 fJ/spike (femtojoule-level), which is at least three orders of magnitude lower than that of the reported biological and artificial neuron (picojoule-level). The ultralow energy consumption makes it possible to create an electronic neural network that reduces the energy consumption compared to human brain. By integrating the reconfigurable synapse, neuron and heating resistor, a smart textile system is successfully constructed for warm fabric application, providing a unique functional reconfiguration pathway toward the next-generation in-memory computing textile system.

Emulating Ebbinghaus forgetting behavior in a neuromorphic device based on 1D supramolecular nanofibres

“…Device functioning as detailed above consumes only ∼1.06 pJ per synaptic junction (see Note S1, ESI†), which is comparable to the reported values from other neuromorphic devices. 40,41…”

Technology Roadmap for Flexible Sensors

“…Textiles are another form factor that holds great promise. − Many advanced functions have been demonstrated on textile platforms, and integrated systems can achieve energy harvesting, energy storage, sensing, display, and simple signal processing. ,, Furthermore, industrial scale or industry-compatible production has been reported, ,,,, and commercial products have started to emerge . Smart textiles might not be far from large-scale deployment.…”

Soft Fiber Electronics Based on Semiconducting Polymer

“…Currently, fibers and textiles with sensing, energy supply, and actuation capabilities have become popular research topic. , Unlike conventionally postassembled wearable devices, fiber-shaped devices can be assembled during fabric production . This one-step formation technique guarantees the overall comfort and mechanical properties of the fabric . Moreover, various topologies based on the weaving process permit flexible arrangement and more effective connecting of fiber devices, thereby improving the unit area density and working efficiency of the device .…”

“…23 This one-step formation technique guarantees the overall comfort and mechanical properties of the fabric. 177 Moreover, various topologies based on the weaving process permit flexible arrangement and more effective connecting of fiber devices, thereby improving the unit area density and working efficiency of the device. 177 The key to the development of all-fabric flexible wearable systems is the incorporation of logic computing functions into fibers and textiles.…”

“…177 Moreover, various topologies based on the weaving process permit flexible arrangement and more effective connecting of fiber devices, thereby improving the unit area density and working efficiency of the device. 177 The key to the development of all-fabric flexible wearable systems is the incorporation of logic computing functions into fibers and textiles. 178 Previously reported fabric-based logic circuits can perform large-area information processing through a combination of logic components such as transistors, memristors, and commercial chips (Table 1).…”