Recoil implantation of boron into silicon for ultrashallow junction formation: Modeling, fabrication, and characterization

Abstract

An ion-beam mixing technique is used to fabricate ultrashallow p ϩ /n junctions. In this method, a thin boron layer is first sputter deposited onto the Si wafer surface. Then a 10-40 keV Ge ion beam or Ϫ3 kV Ar plasma source ion implantation ͑PSII͒ is used to knock the boron atoms into the Si substrate by means of ion-beam mixing. For the thin ͑0.7 nm͒ boron layers used in this effort, a selective etch for the removal of boron is unnecessary. Sub-100 nm p ϩ /n junctions have been realized with this method. Numerical simulations, performed to predict the recoiled boron profiles, show good agreement between the simulated and measured data.