Recent research development in flip-chip routing

Intelligent design automation for 2.5/3D heterogeneous SoC integration

“…RDL routing provides signal redistribution in the chip level (in traditional flip-chip packages) [21] or in the package level (in interposers or package substrates). Existing RDL routing techniques can be classified by their targeting structures:…”

Numerical analysis of thermo-mechanical characteristics of solder joint depending on change in solder junction structure of MCP

“…Owing to the development of 3D packaging technology such as multi-chip package (MCP), semiconductor package has become light, thin, short and small with high density and fine pitch [1][2][3][4][5][6][7][8].…”