Recent progress on the development of Sn–Bi based low-temperature Pb-free solders

Wang, Fengjiang; Chen, Hong; Huang, Ying; Liu, Luting; Zhang, Zhijie

doi:10.1007/s10854-019-00701-w

Cited by 137 publications

(54 citation statements)

References 107 publications

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“…Therefore, the interface in 0.5Zn contained solder joints after aging at 130 and 150 • C was composed of Cu 6 (Sn, Zn) 5 , Cu 5 Zn 8 , and Cu 6 (Sn, Zn) 5 . After aging at 170 • C, the Cu 5 Zn 8 IMC layer was completely decomposed within a short aging time, and the interface was mainly composed of Cu 6 (Sn, Zn) 5 .…”

Section: Discussionmentioning

confidence: 99%

“…Therefore, the Cu 6 Sn 5 IMC layer formed during soldering continuously grew with aging. 6Cu + 5Sn → Cu 6 Sn 5 (4) Moreover, Cu 3 Sn was also formed at the interface between Cu 6 Sn 5 and Cu substrate due to the reaction of the diffused Cu atoms with Cu 6 Sn 5 , as shown in the Equation (5).…”

Section: Discussionmentioning

confidence: 99%

“…(2) With 0.2% Zn addition, Zn atoms can be dissolved into the interfacial IMCs to form Cu 6 (Sn, Zn) 5 . Zn atoms were segregated along the interface between Cu-Sn IMCs and Cu substrate, which completely inhibited the formation of Cu 3 Sn between Cu 6 (Sn, Zn) 5 and Cu. The lower IMC growth rate was mainly attributed to the deficiency of Cu 3 Sn and higher activation energy of IMCs growth.…”

Section: Discussionmentioning

confidence: 99%

“…As shown in Figure 1e, the shape of the IMC is a flat layer, and it can be seen that the IMC is composed of two layers, and the color of one near solder is deeper than that near Cu substrate. According to EDX analysis of the dark IMC at point C, as shown in Figure 1f, the ratio of Cu atoms to Zn atoms is close to 1:1, so that the compounds having a darker color near solder matrix is Cu 5 Zn 8 , and the lighter color compound is analyzed by EDX as Cu 6 (Sn, Zn) 5 . At the same time, it can be seen that the generated Cu 6 Sn 5 does not fill the gap between dark IMC and Cu substrate.…”

Section: As-soldered Jointsmentioning

confidence: 99%

“…However, other solders are being developed due to a high Ag cost and lower drop reliability from Sn-Ag-Cu solders [4]. Sn-Bi solder is one of them due to its low melting point (139 • C) and good mechanical properties [5]. However, large amounts of Bi in Sn-58Bi eutectic increases the brittleness of the solder alloy because of the brittleness nature of Bi phases [6].…”

Section: Introductionmentioning

confidence: 99%

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Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition

2019

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Excessive growth of intermetallic compounds (IMCs) during service affects the reliability of solder joints, so how to suppress the growth of IMC thickness at the interface in solder joints becomes a widespread concern. In this work, the interfacial reaction between Sn-10Bi solder and Cu substrate after thermal aging was investigated. Moreover, to depress the IMC growth at the interface, trace amounts of Zn was added into the Sn-10Bi solder, and the interfacial reactions of Sn-10Bi-xZn solders (x = 0.2, 0.5) and Cu substrate after thermal aging were studied in this paper. Compounds such as Cu6(Sn, Zn)5 and Cu5Zn8 were formed at the interface after adding trace amounts of Zn. The addition of 0.2 and 0.5 wt% Zn significantly inhibited the thickness growth of IMCs and the formation of Cu3Sn IMC at the interface of Sn-10Bi-0.2Zn/Cu and Sn-10Bi-0.5Zn/Cu during thermal aging. Therefore, the addition of trace Zn had an obvious effect on the interfacial reaction of Sn-10Bi/Cu solder joint. Interestingly, the evolution of IMC thickness in Sn-10Bi-0.5Zn/Cu solder joints was completely different from that in Sn-10Bi or Sn-10Bi-0.2Zn solder joints, in which the spalling of IMCs occurred. In order to explore the mechanisms on the depressing effect from the addition of trace Zn, the activation energy Q in solder joints during aging was calculated.

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Section: Discussionmentioning

confidence: 99%

Section: Discussionmentioning

confidence: 99%

Section: Discussionmentioning

confidence: 99%

Section: As-soldered Jointsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition

2019

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Microstructural Evolution and Mechanical Properties of Sn‐58Bi Solder Alloys with Different Cooling

et al. 2021

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Herein, influences of air-cooling, water-cooling, and liquid nitrogen-cooling (LN-cooling) on microstructures and mechanical properties of Sn-58Bi alloy are studied. It is observed that nearly complete eutectic structures are obtained in aircooled Sn-58Bi alloy. Fine grains and many low-angle grain boundaries (LAGBs) are obtained in water-cooled Sn-58Bi alloy. The LN-cooling method causes Bi atoms to form large, regular rectangular shapes, and there are many high-angle grain boundaries (HAGBs) distributed inside the specimen. Impact tests are performed at room temperature. When the impact rate is 0.98 m s À1 , the fracture energy of the water-cooled Sn-58Bi alloy peaks to 71.5 mJ. The fracture of the LN-cooled impact specimen has a large cleavage step due to the interaction of cleavage cracks and the HAGBs. These experimental results lay the relevant theoretical foundation for the practical application of Sn-58Bi solder alloys.

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Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review

Pal

Bajaj²

2023

Adv Eng Mater

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Void nucleation is a critical issue in wetting because it negatively impacts the solder joint and diminishes its electrical and mechanical properties. Generally, the Kirkendall effect (unbalanced diffusion) and Kirkendall voids (KVs) are developed due to dissimilar diffusivities of species (Cu and Sn) in a diffusion process. However, voids are also nucleated in the supersaturating condition, creating an additional position at or inside the “Kirkendall voids” interface. Various factors (surface modification, reinforcement of fourth elements, substrate type, and impurities) and the environment also support the nucleation of voids. Many researchers have discussed that KVs are nucleated into to intermetallic compounds layers. Reviewing the significant parameters for developing the KV in solid–liquid and solid–solid conditions is essential. Hence, in this review, the potential process of development of the KVs, concepts of thermodynamics, chemical reactions, and growth kinetics are developed. The position and reduction of KVs nucleation are also explained in this paper.

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Recent progress on the development of Sn–Bi based low-temperature Pb-free solders

Cited by 137 publications

References 107 publications

Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition

Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition

Microstructural Evolution and Mechanical Properties of Sn‐58Bi Solder Alloys with Different Cooling

Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review

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