Recent progress in the fabrication of high-Jc tapes by epitaxial deposition of YBCO on RABiTS

Biaxially textured copper and copper–iron alloy substrates for use in YBa2Cu3O7−xcoated conductors

“…These advancements have been made primarily using Ni or Ni-alloy substrates, especially Ni-W [2][3][4]. An attractive alternative to Ni-based substrates may be Cu-based substrates since copper is six times cheaper than nickel on a kilogram per kilogram basis.…”

Superconducting materials for large scale applications

“…A strong [100] cube texture is introduced into the substrate by conventional rolling and recrystallization. Although the RABiTS approach was developed initially with pure nickel [72], substrate materials with more robust mechanical properties and reduced magnetism, notably nickel with 5 atomic % tungsten, have now replaced pure Ni and achieved FWHM below 5 [73].…”

The Effect of Sintering Oxygen Partial Pressure on a SmBiO3 Buffer Layer for Coated Conductors via Chemical Solution Deposition

“…Coated conductors are mainly composed of a textured substrate, a buffer layer, and a superconducting layer. So far, there are two practical routes to obtain textured substrates: rolling assisted biaxially textures (RABiTS) [2,3] and ion beam assisted deposition (IBAD) [4][5][6]. Ni-based alloy tape with yttrium-stabilized zirconia (YSZ) seed layer deposited via an IBAD route (named IBAD-YSZ tape) is a textured substrate suited for coated conductors [6].…”

“…The growth of the buffer layer prepared via CSD methods with traditional materials should be achieved at a relatively high sintering temperature of 900-1150 • C because of their high melting point [9]. In order to lower the sintering temperature of the buffer layer for coated conductors in CSD processing, a class of new buffer materials, REBiO 3 (RE correspond to a rare earth element), were developed, and their physical and chemical property were systematically characterized [11,12]. A REBiO 3 buffer layer can be epitaxially grown at a relatively low temperature of around 700-900 • C [12][13][14][15][16][17] because of its low formation temperature.…”

“…Lowering the processing temperature not only means saving energy and reducing cost, but can also avoid or reduce some of the difficulties of manufacturing coated conductors, e.g., avoiding mechanical strength degradation at high temperatures for metal substrates and reducing chemical diffusion in the interface of the buffer layer and substrate. In addition, once formed, the REBiO 3 buffer layer possesses very good thermal stability as studied via thermal decomposition experiments in different oxygen partial pressures for YBiO 3 (YBO) precursor powders [13]. Taking these advantages, YBO and SmBiO 3 (SBO) films have been successfully grown in air [14,15].…”