Recent improvements and developments in uncooled systems at BAE SYSTEMS North America

Abstract

BAE SYSTEMS has designed and developed MicroIR microbolometer focal plane arrays (FPAs) in three formats (160x120, 320x240, and 640x480) and with two different pixel sizes (46µm and 28µm). In addition to successfully demonstrating these FPA technologies, BAE SYSTEMS has produced and delivered thousands of 320x240 (46µm pixel) imaging modules and camera cores for military, thermography, firefighting, security and numerous other applications throughout the world. Recently, BAE SYSTEMS has started production deliveries of 160x120 (46µm) systems, demonstrated 320x240 and 640x480 second-generation (28µm) imaging, and demonstrated second-generation thermoelectric cooler-less operation. This paper discusses these recent accomplishments and, when possible, provides quantitative NETD and performance data for our newly developed FPAs and systems. Video will be shown to demonstrate sensor performance capabilities.

IR detection with uncooled sensors

“…High performance is already demonstrated with this technology and the challenge is now to be able to reduce the pixel pitch down to 25 lm. Raytheon [1] and DRS [2] shown first results with a pixel pitch of 25 lm and a double deck structure and BAe with a pixel pitch of 28 lm and a more conventional simple deck structure [3]. The second challenge is to suppress the focal plane temperature stabilization in order to simplify the detector integration in camera.…”

Uncooled IR focal plane arrays: worldwide review and state-of-the-art at ULIS

“…High performance is already demonstrated with this technology and the challenge is now to be able to reduce the pixel pitch down to 25 µm. First results are shown by Raytheon [1] and DRS [2] with a pixel pitch of 25 µm and a double deck structure and by BAe with a pixel pitch of 28 µm and a more conventional simple deck structure [3]. The second challenge is to suppress the focal plane temperature stabilization in order to simplify the detector integration in camera.…”

Modeling, Design, and Fabrication of Self-Doping Si1−xGex/Si Multiquantum Well Material for Infrared Sensing

“…Vanadium oxide and amorphous silicon are the most successful materials and occupy the major commercial market share [5]. The bolometer pixel size is developed to 17 m, while the resolution is to 1920 × 1080 or even more [6,7]. As a result of technical development, the next generation of bolometer should be combined with standard CMOS based integrated circuits to decrease the cost.…”