Recent developments toward a one step thin-film PV interconnection process using laser scribing and inkjet printing

Crozier, Mickey; Adamson, P.; Brunton, Adam N.; Henley, Simon J.; Shephard, Jonathan D.; Kartopu, Giray; Irvine, S.J.C.; Kaminski, Piotr; Walls, John M.

doi:10.1109/pvsc.2014.6925507

Cited by 5 publications

(6 citation statements)

References 12 publications

(4 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…A variety of dielectric materials are potentially useful for printed ICs. Similarly other methods besides aerosol-jet deposition may be used -for example ink-jet printing [10] and screen-printing [8]. Additional dielectric materials examined in this work include poly-4- vinyl-phenol (PVP), and select low temperature siloxane glass materials (i.e.…”

Section: Dielectric Inks For Printed Interconnectsmentioning

confidence: 99%

“…Integrated scriber/printer instruments, such as those reported in Refs. [10] and [14] can accomplish this. The method also eliminates venting and pumping time delays between vacuum-/atmospheric-pressure-based process steps associated with ex-situ transfers in the conventional process (see Fig.…”

Section: Introductionmentioning

confidence: 99%

“…Although Thalheimer patented the original printed IC process almost 30 years ago, the method only recently finds traction in mainstream PV manufacturing [8]. Renewed interest in printing the ICs is evidenced by numerous patents filed in the last several years in this area [9][10][11][12] and multiple developmental efforts launched by collaborative technology consortiums [13,14]. The increased attention follows key advances in direct-write, printedelectronics technologies in the last several decades.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Printed interconnects for photovoltaic modules

Fields

Pach

Horowitz

et al. 2017

Solar Energy Materials and Solar Cells

View full text Add to dashboard Cite

Film-based photovoltaic modules employ monolithic interconnects to minimize resistance loss and enhance module voltage via series connection. Conventional interconnect construction occurs sequentially, with a scribing step following deposition of the bottom electrode, a second scribe after deposition of absorber and intermediate layers, and a third following deposition of the top electrode. This method produces interconnect widths of about 300 µm, and the area comprised by interconnects within a module (generally about 3 %) does not contribute to power generation. The present work reports on an increasingly popular strategy capable of reducing the interconnect width to less than 100 µm: printing interconnects. Cost modeling projects a savings of about $0.02/watt for CdTe module production through the use of printed interconnects, with savings coming from both reduced capital expense and increased module power output. Printed interconnect demonstrations with copper-indium-gallium-diselenide and cadmiumtelluride solar cells show successful voltage addition and miniaturization down to 250 µm. Material selection guidelines and considerations for commercialization are discussed.

show abstract

Section: Dielectric Inks For Printed Interconnectsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Printed interconnects for photovoltaic modules

Fields

Pach

Horowitz

et al. 2017

Solar Energy Materials and Solar Cells

View full text Add to dashboard Cite

show abstract

“…[25,26] Several publications show different hybrid modularization approaches partly using the inkjet technology to apply dielectric and conductive inks. [27][28][29][30][31][32][33] These printing technologies are able to achieve competitive throughputs with a proven track record of industrial application in numerous sectors. The dispensing (DIS) approach is an alternative promising printing technology to SP and inkjet printing to apply the metal grid on TCO surfaces.…”

Section: Introductionmentioning

confidence: 99%

CIGS Mini‐Modules with Dispensed Metallization on Transparent Conductive Oxide Layer

et al. 2020

View full text Add to dashboard Cite

This article presents the application of a parallel dispensing device for low‐temperature silver paste metallization on transparent conductive oxide (TCO) layers of Cu(In1 − xGax)Se2 (CIGS) substrates as an alternative metallization technology to screen printing and inkjet printing. A curing variation experiment is performed to analyze the effect of different curing conditions on the resulting contact resistivity of the metal grid. Contact resistivity values below 5 mΩcm2 are achieved. Furthermore, CIGS mini‐modules are metallized with three different low‐temperature paste formulations obtaining a record core finger geometry of 25 μm and an average optical aspect ratio of 0.46 using 25 μm nozzle openings. The dispensed metal grid on the TCO layers achieves the comparable current density values of jsc = 32.2 mA cm−2 and the open‐circuit voltages values per cell of Voc = 672 mV as the screen printed metal grid on CIGS mini‐modules and, hence, a nominal power of 2.05 W. The metal grid enables the use of broader cell widths compared with grid‐free CIGS samples and results in a reduced dead area.

show abstract

“…Other possibilities include using low-Na glass substrates or adapting the one-step interconnect process previously invented for CdTe solar modules, where the P1 lines are scribed after all device layers have been deposited and then filled with a dielectric material. [44] Na intrusion from SLG into the active layers of a PSM is an understudied topic, especially compared to other thin-film PV devices. To cite just an example, Na migration from SLG has been identified as the primary mechanism of potential-induced degradation in CuInGaS/Se solar cells.…”

Section: Discussionmentioning

confidence: 99%

Sodium Diffuses from Glass Substrates through P1 Lines and Passivates Defects in Perovskite Solar Modules

Kosasih

Giacomo

Orri

et al. 2023

Energy & Environ Materials

View full text Add to dashboard Cite

Most thin‐film photovoltaic modules are constructed on soda‐lime glass (SLG) substrates containing alkali oxides, such as Na2O. Na may diffuse from SLG into a module's active layers through P1 lines, an area between a module's constituent cells where the substrate‐side charge transport layer (CTL) is in direct contact with SLG. Na diffusion from SLG is known to cause several important effects in II–VI and chalcogenide solar modules, but it has not been studied in perovskite solar modules (PSMs). In this work, we use complementary microscopy and spectroscopy techniques to show that Na diffusion occurs in the fabrication process of PSMs. Na diffuses vertically inside P1 lines and then laterally from P1 lines into the active area for up to 360 μm. We propose that this process is driven by the high temperatures the devices are exposed to during CTL and perovskite annealing. The diffused Na preferentially binds with Br, forming Br‐poor, I‐rich perovskite and a species rich in Na and Br (Na‐Br) close to P1 lines. Na‐Br passivates defect sites, reducing non‐radiative recombination in the perovskite and boosting its luminescence by up to 5×. Na‐Br is observed to be stable after 12 weeks of device storage, suggesting long‐lasting effects of Na diffusion. Our results not only point to a potential avenue to increase PSM performance but also highlight the possibility of unabated Na diffusion throughout a module's lifetime, especially if accelerated by the electric field and elevated temperatures achievable during device operation.

show abstract

Recent developments toward a one step thin-film PV interconnection process using laser scribing and inkjet printing

Cited by 5 publications

References 12 publications

Printed interconnects for photovoltaic modules

Printed interconnects for photovoltaic modules

CIGS Mini‐Modules with Dispensed Metallization on Transparent Conductive Oxide Layer

Sodium Diffuses from Glass Substrates through P1 Lines and Passivates Defects in Perovskite Solar Modules

Contact Info

Product

Resources

About