2009
DOI: 10.1016/j.solmat.2008.11.056
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Recent developments in rear-surface passivation at Fraunhofer ISE

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Cited by 59 publications
(34 citation statements)
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“…10 In contrast, lowtemperature SiO x synthesized by plasma enhanced chemical vapor deposition ͑PECVD͒ in combination with a SiN x capping layer has not resulted in a comparable high level of passivation yet. For such PECVD SiO x / SiN x stacks, the lowest value ͑S ef f ϳ 40 cm/ s͒ was reported recently by Hofmann et al 9 for low resistivity p-type c-Si.…”
mentioning
confidence: 78%
“…10 In contrast, lowtemperature SiO x synthesized by plasma enhanced chemical vapor deposition ͑PECVD͒ in combination with a SiN x capping layer has not resulted in a comparable high level of passivation yet. For such PECVD SiO x / SiN x stacks, the lowest value ͑S ef f ϳ 40 cm/ s͒ was reported recently by Hofmann et al 9 for low resistivity p-type c-Si.…”
mentioning
confidence: 78%
“…In Ref. [9] three different passivating configurations are used: a stack of PECVD amorphous silicon and silicon oxide layers, an amorphous silicon carbide film and a triple stack of silicon oxide and silicon nitride. In all three cases solar cells with efficiencies beyond 20% have been obtained.…”
Section: Introductionmentioning
confidence: 99%
“…To overcome bulk lifetime degradation, a low-temperature SiO x deposition by PECVD has been studied by different groups [33][34][35] for surface passivation. Another option for the synthesis of SiO x is a chemical oxidation of the Si surface using nitric acid (HNO 3 ).…”
Section: Sio Xmentioning
confidence: 99%