Recent Developments in Mechanical Specimen Preparation for Tem and Sem Applications

Abstract

<jats:p>The continued reduction in the size of critical features in integrated circuits has resulted in the need to develop rapid, site-specific, sectioning techniques to enable efficient physical characterization of the structures of interest. We have implemented a mechanical polishing approach to achieve this objective with the additional goals of maximizing the number of targeted sites in a sample that can be analyzed, and minimizing physically destructive procedures, such as ion beam exposure. Precision sample preparation approaches have been under investigation for both transmission electron microscopy and scanning electron microscopy.</jats:p><jats:p>The mechanical specimen preparation approach used in this work is a variant of the well-known wedge polishing technique. Here we use a polishing tool that does not contact the grinding surface, thus allowing precise control of the wedge angle. Prior to sample preparation, the polishing tool head was precision aligned parallel to the platen.</jats:p>

Transmission Electron Microscope Specimen Preparation of Metal Matrix Composites Using the Focused Ion Beam Miller

“…A number of FIB studies were performed at a range of tilt angles and accelerating voltages, but were not deemed to be effective in reducing the amount of redeposition or ion damage. It has also been suggested that conventional argon ion milling at low energies with very shallow incidence angles is effective in removing damage layers (Li et al, 1999). However, such mills were not performed in this study.…”