Recent Advances on Thermal Management of Flexible Inorganic Electronics

Li, Yuhang; Chen, Jiayun; Zhao, Shuang; Song, Jizhou

doi:10.3390/mi11040390

Cited by 5 publications

(3 citation statements)

References 90 publications

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“…The fracture toughness of LM/PBSE with different matrix components and Φ LM is also investigated by the crack propagation test. , During the test, the specimen with an initial crack is stretched at a constant strain rate of 0.01 s –1 , and cracks for all specimens propagated perpendicular to the loading direction, showing typical penetrating crack morphologies (SI Figure S9). Notably, the critical strain (ε c ) is defined as the strain until the LM/PBSE was destroyed.…”

Section: Results and Discussionmentioning

confidence: 99%

High-Performance Liquid Metal/Polyborosiloxane Elastomer toward Thermally Conductive Applications

Zhao

Wang

Gao

et al. 2022

ACS Appl. Mater. Interfaces

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With the combination of high flexibility and thermal property, thermally conductive elastomers have played an important role in daily life. However, traditional thermally conductive elastomers display limited stretchability and toughness, seriously restricting their further development in practical applications. Herein, a high-performance composite is fabricated by dispersing room-temperature liquid metal microdroplets (LM) into a polyborosiloxane elastomer (PBSE). Due to the unique solid–liquid coupling mechanism, the LM can deform with the PBSE matrix, achieving higher fracture strain (401%) and fracture toughness (2164 J/m2). Meanwhile, the existence of LM microdroplets improves the thermal conductivity of the composite. Interestingly, the LM/PBSE also exhibits remarkable anti-impact, adhesion capacities under complex loading environments. As a novel stretchable elastomer with enhanced mechanical and thermal behavior, the LM/PBSE shows good application prospects in the fields of thermal camouflages, stretchable heat-dissipation matrixes, and multifunctional shells for electronic devices.

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Section: Results and Discussionmentioning

confidence: 99%

High-Performance Liquid Metal/Polyborosiloxane Elastomer toward Thermally Conductive Applications

Zhao

Wang

Gao

et al. 2022

ACS Appl. Mater. Interfaces

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“…The development of electronic skin has led to the necessity of long-term conformally attached devices to collect physiological information [ 31 , 33 , 34 ], which has highlighted the importance of comfort in the design of electronic skin [ 35 ]. The uncomfortable sensations induced by electronic skin can be attributed to the mechanical [ 36 , 37 , 38 , 39 ], thermal [ 40 , 41 , 42 , 43 , 44 , 45 , 46 ], and electrical [ 47 , 48 ] stimuli during operation. On the one hand, these stimuli comprise the on-demand therapeutics applied by the electronic skin, which is able to reduce long-term medical costs and health risks.…”

Section: Introductionmentioning

confidence: 99%

Skin Comfort Sensation with Mechanical Stimulus from Electronic Skin

Ji,

Zhu,

et al. 2024

Materials

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The field of electronic skin has received considerable attention due to its extensive potential applications in areas including tactile sensing and health monitoring. With the development of electronic skin devices, electronic skin can be attached to the surface of human skin for long-term health monitoring, which makes comfort an essential factor that cannot be ignored in the design of electronic skin. Therefore, this paper proposes an assessment method for evaluating the comfort of electronic skin based on neurodynamic analysis. The holistic analysis framework encompasses the mechanical model of the skin, the modified Hodgkin–Huxley model for the transduction of stimuli, and the gate control theory for the modulation and perception of pain sensation. The complete process, from mechanical stimulus to the generation of pain perception, is demonstrated. Furthermore, the influence of different factors on pain perception is investigated. Sensation and comfort diagrams are provided to assess the mechanical comfort of electronic skin. The comfort assessment method proposed in this paper provides a theoretical basis when assessing the comfort of electronic skin.

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“…The poor heat dissipation capacity of soft polymer substrates, which have a thermal conductivity on the order of 0.1 W m −1 K −1 , is much lower than that of conventional silicon substrates (∼100 W m K −1 ) and may induce a large temperature increase in the functional components, causing device performance degradation [45]. Therefore, thermal management has become one of the most important challenges for polymer-based soft electronic devices [46]. This review aims to draw a mid-term roadmap regarding nanotechnology-based approaches for the printing of soft electronics on polymeric materials, especially stretchable ones.…”

Section: Introductionmentioning

confidence: 99%

Nanomaterials and printing techniques for 2D and 3D soft electronics

et al. 2022

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The merging of electronically conductive elements with soft polymeric materials gave birth to the novel field of soft and stretchable electronics and robotics, where the key aspect is the maintenance of the electrical properties even under severe mechanical deformation. Here we review the variety of fabrication techniques that have been designed, studied and tested, leading to foresee how soft technologies can have a revolutionary impact in the progress of biomedicine and pre-clinical practice, wearable electronics, environmental monitoring and recognition, smart farming and precision agriculture, energy harvesting and storage. A particular focus is given to wet and dry techniques for 2D and 3D printed electronics that allow the coupling of compliant conductive elements on complex three-dimensional objects and platforms. We discuss how a selection and a targeted optimization amongst different nanoscale building blocks nanomaterials and deposition techniques are now necessary. The watchwords to be prioritized are scalability, versatility, environmental sustainability and biocompatibility, integration and reduction of the fabrication steps. The target is the design of an eco-friendly and versatile approach for the full additive manufacturing of free-form advanced soft electronic devices, eventually biocompatible and biodegradable, with a multi-layer and multi-material process able to print both active and passive 3D elements on soft polymeric platforms. The sequential combination of dry and wet spray printing shows to be one of the most promising approach.

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Recent Advances on Thermal Management of Flexible Inorganic Electronics

Cited by 5 publications

References 90 publications

High-Performance Liquid Metal/Polyborosiloxane Elastomer toward Thermally Conductive Applications

High-Performance Liquid Metal/Polyborosiloxane Elastomer toward Thermally Conductive Applications

Skin Comfort Sensation with Mechanical Stimulus from Electronic Skin

Nanomaterials and printing techniques for 2D and 3D soft electronics

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