Recent advances of interconnection technologies using anisotropic conductive films

Watanabe, Ikumu; Fujinawa, T.; Arifuku, Michiharu; Kobayashi, Kōji; Gotoh, Yasushi

doi:10.1109/agec.2004.1290910

Cited by 7 publications

(2 citation statements)

References 1 publication

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“…From this viewpoint, the development of anisotropic conductive film (ACF) technology is consistent with the recent trends of electronic packaging industry because it can replace traditional soldering or underfill encapsulation process, which may cause environmental problems and high cost. Thus it is being widely used for packaging technology in flat panel display, such as tape carrier package,1 chip on glass,2 or chip on film,3–4 and is extending its application field to flip chip packaging 5–10…”

Section: Introductionmentioning

confidence: 99%

Observation for mechanical property variations of single polymer particles

Kim

Jin

Shon

et al. 2007

J of Applied Polymer Sci

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Monodisperse polymer particles were prepared via conventional microsuspension polymerization or one-step seeded polymerization, using 1,6-hexanedioldiacrylate or its mixture with ethylene glycol dimethacrylate (EGDMA) as crosslinking monomer and poly(methyl methacrylate) synthesized by soap-free polymerization as seed particles. For the study, the effects of the ratio of the absorbed monomer or monomer mixture to the seed polymer particles (swelling ratio), the ratio of EGDMA in absorbed monomer mixture, the dosage of initiator, polymer particle structure, and the electroless Ni plating on the mechanical properties of polymer particles, such as recovery rate, K-values, breaking strength, and breaking displacement were investigated using micro compression test. It was observed that monomer swelling ratio influenced only on breaking strength, whereas EGDMA ratio in monomer mixture, dosage of initiator, polymer structure and electroless Ni plating did on both K-values and breaking strength.

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Section: Introductionmentioning

confidence: 99%

Observation for mechanical property variations of single polymer particles

Kim

Jin

Shon

et al. 2007

J of Applied Polymer Sci

View full text Add to dashboard Cite

show abstract

“…In recent years, increased attention has been paid to the development of new electronic packaging technology for making electronic products lighter and smaller, and one of successful examples is the development of anisotropic conductive film technology. Because it can replace conventional soldering and underfill encapsulation processes causing environmental problems and high cost, it is being widely used for packaging technology in flat panel display, such as tape carrier package,1 chip on glass,2 or chip on film,3, 4 and is extending its application field to flip chip packaging 5–10…”

Section: Introductionmentioning

confidence: 99%

Investigation for surface morphology and mechanical property variations of single polymer particles

Kim

Jin

2007

J of Applied Polymer Sci

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Monodisperse polymer particles were prepared via one-step seeded polymerization using polystyrene, poly(methyl methacrylate), or styrene/methyl methacrylate copolymer [poly(ST-co-MMA)] as seed particles and 1,6-hexanedioldiacrylate or divinylbenzene as crosslinking monomer. For the study, the effects of the combination of seed polymer and crosslinking monomer, the ratio of the absorbed monomer to the seed polymer particles (swelling ratio: S/R), and the seeded polymerization rate on the variation of surface morphology and mechanical properties of polymer particles, such as recovery rate, K-values, breaking strength, and breaking displacement were investigated by using microcompression test. It was observed that the surface morphology could be controlled by changing polymerization rate or combination of seed polymer and crosslinking monomer, and it had a great influence on mechanical properties, especially the breaking strength.

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Resistance characterization of Au bump and anisotropic conductive adhesives under temperature and moisture conditions

Lee

Yeo

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

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Recent advances of interconnection technologies using anisotropic conductive films

Cited by 7 publications

References 1 publication

Observation for mechanical property variations of single polymer particles

Observation for mechanical property variations of single polymer particles

Investigation for surface morphology and mechanical property variations of single polymer particles

Resistance characterization of Au bump and anisotropic conductive adhesives under temperature and moisture conditions

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