Recent advances of interconnection technologies using anisotropic conductive films in flat panel display applications

Study of Structure and Failure Mechanisms in ACA Interconnections Using SEM

“…Typically the number of particles is 0.5% -5 % by volume (Licari, 2005) but depends largely on the size and shape of the conducting particles and on the application the ACA is used in (Watanabe, 2004). Normally the particles are randomly dispersed in the matrix, but adhesives having uniformly dispersed particles have also been developed (Ishibashi & Kimura, 1996;Jin et al, 1993;Sungwook & Chappell, 2010).…”

ACF particle distribution in COG process

“…The LCD packaging process connects the driver IC onto the TFT glass substrate for electrical interconnection. Chip on Glass (COG) [2][3][4][5][6], tape automatic bonding (TAB), and chip on film (COF) [6][7][8] are three kinds of driver IC interconnection methods in the LCD module process. Most small and medium LCD module processes apply COG packaging technology.…”

“…It is unlike the COG process in which a rigid driver IC is bonded onto the glass substrate. Stress is created and glass substrate warpage is produced, which influences the display quality [3,4,6]. The process requirements for COG bonding are therefore stricter than that for the COF/TAB process.…”

“…The process requirements for COG bonding are therefore stricter than that for the COF/TAB process. Most researches studied the ACF material contents and the bonding process parameters [6][7][8]. In general, the COG design cost structure is cheaper than that for COF/TAB design because COF/TAB flexible film with fine pitch involves high cost.…”

“…The conductive particles are deformed by the external force between the glass substrate and the driver IC. The conductive property in the COG process is influenced by a lot of factors, such as the electrode material, drive IC bump, adhesive, conductive particles [10][11][12], bump roughness and the connecting parameters [6][7][8]. ACF particle conductive models were studied in previous researches [13][14][15][16][17].…”