Recent advances of discrete coordination complexes and coordination polymers in drug delivery

Ma, Zhenbo; Moulton, Brian

doi:10.1016/j.ccr.2011.01.031

Cited by 288 publications

(127 citation statements)

References 133 publications

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“…MOF are nanoporous, crystalline materials that consist of metal ions that are connected by organic linkers. [70][71][72][73][74][75] By varying the metal ion or linker, various sizes and shapes of channels or cavities can be obtained. 76 The interest in these materials first appeared after the theoretical paper by K. Zagorodniy and co-authors, who calculated the dielectric constant of a series of MOF based on Zn 4 O(CO 2 ) 4 units connected by different organic linkers and found that all the investigated MOF have k-values below 2.0 with good mechanical properties.…”

Section: Low-k Dielectrics For Future Technology Nodesmentioning

confidence: 99%

Mechanical Stability of Porous Low-k Dielectrics

Vanstreels

Baklanov

2014

ECS J. Solid State Sci. Technol.

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This paper reviews the mechanical and fracture properties of porous ultralow-k dielectrics with the focus on chip package interaction related issues. It is shown that the mechanical and fracture properties of porous ultralow-k dielectric films are closely linked with porosity, pore morphology, network structure and deposition technology, while their fracture properties are also sensitive to reactive species in the environment. The survivability of low-k dielectrics upon integration, package assembly and subsequent reliability tests is therefore a combination of their mechanical stability, fracture properties, the specific mechanical or thermo-mechanical load and environmental effects. For the past three decades, the semiconductor industry has been improving the performance of microelectronic devices and the functionality of advanced integrated circuits through the continuous scaling of integrated circuits and the maximization of transistor density.1 Consequently, this encourages the introduction of new materials, processes, chip designs, and packaging strategies into micro-/nano-electronic products. Among these material innovations are insulating materials with a dielectric constant (k) less than that of SiO 2 , so called low-k dielectrics. During the last 15 years, various materials and methods have been developed for fabricating low-k dielectric films, among which the plasma enhanced chemical vapor deposition (PECVD) technology of porous organosilicate glasses (OSG) is the most popular due to its better compatibility with the technological needs.2-5 The reduction in k for low-k dielectrics is being pursued through the introduction of controlled levels of porosity. However, finding a good low-k material has proven to be much more challenging than first expected due to a number of integration and reliability issues.1 Besides the need of being compatible with the different lithography, etching, stripping and cleaning processes that are used in state-of-the-art integration schemes, they must also have sufficient mechanical strength to withstand the high shear stresses as well as harsh chemical environments that are involved during the chemical mechanical polishing process without cohesive or adhesive failure occurring.6-8 On top of that, since low-k dielectrics exhibit intrinsic tensile stresses and have increased coefficients of thermal expansion compared to SiO 2 , thin film cracking and adhesion are serious thermal-mechanical reliability issues for low-k dielectric materials (Figure 1). 9,10 Thermo-mechanical deformation of the package during package assembly and subsequent reliability tests can induce large local stresses that can initiate and propagate cohesive and/or adhesive cracks in different back-end of line (BEOL) layers.11 Therefore, a careful characterization of the mechanical integrity of potential new low-k candidates is required to integrate these new materials and Cu interconnects and to assure reliability during chip packaging and under field conditions. In the microelectronics industry, the elas...

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Section: Low-k Dielectrics For Future Technology Nodesmentioning

confidence: 99%

Mechanical Stability of Porous Low-k Dielectrics

Vanstreels

Baklanov

2014

ECS J. Solid State Sci. Technol.

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“…Among all, particularly interesting are hydrogen storage applications in energy conservative technologies and clean energy. Recent scenario with subsequent generation of MOFs have rationalized with applications extending to technologically relevant domains like non linear optics (NLO) materials [14], spin crossover materials [15][16][17][18], porous magnets [12,[19][20][21][22], and for medical applications [23][24][25] like drug deliveries, implantable devices, diagnostic sensors, and imaging sensors.…”

Section: Introductionmentioning

confidence: 99%

Coordination Polymers and Metal Organic Frameworks Derived from 1,2,4-Triazole Amino Acid Linkers

et al. 2011

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Abstract:The perceptible appearance of biomolecules as prospective building blocks in the architecture of coordination polymers (CPs) and metal-organic frameworks (MOFs) are redolent of their inclusion in the synthon/tecton library of reticular chemistry. In this frame, for the first time a synthetic strategy has been established for amine derivatization in amino acids into 1,2,4-triazoles. A set of novel 1,2,4-triazole derivatized amino acids were introduced as superlative precursors in the design of 1D coordination polymers, 2D chiral helicates and 3D metal-organic frameworks. Applications associated with these compounds are diverse and include gas adsorption-porosity partitioning, soft sacrificial matrix for morphology and phase selective cadmium oxide synthesis, Fe II spin crossover materials, zinc-β-lactamases inhibitors, logistics for generation of chiral/non-centrosymmetric networks; and thus led to a foundation of a new family of functional CPs and MOFs that are reviewed in this invited contribution.

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“…The design and synthesis of novel coordination polymers (CPs) continues to attract great attention because of their structural diversity and potential applications in areas such as catalysis, 1 gas separation and sorption, 2--4 sensing, 5 energy conversion, 6--8 medicine, 9 drug delivery 10 and magnetism. 11 By carefully choosing metal nodes and organic linkers, desired materials such as one--, two--and three--dimensional (1D, 2D and 3D) compounds can be obtained and hence the structure design can be rationalised by the secondary building unit (SBU).…”

Section: Introductionmentioning

confidence: 99%