Recent advances in photosensitive polyimides

Ahne, Hellmut; Leuschner, Rainer; Rubner, Roland

doi:10.1002/pat.1993.220040402

Cited by 32 publications

(20 citation statements)

References 16 publications

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“…However, the shift in peak from 410 to 424 nm was observed. This bathochromic shift with increase in curing temperature has been reported in polyimide previously [14]. This peak almost disappears in 3008C-cured samples indicating that these complexes are decomposed at this temperature and are probably converted into oxides as reported in various literatures [8].…”

Section: Uv-vis Absorption Studies Of Metallopolyimide Filmssupporting

confidence: 85%

Study of fluorescent nanoparticle comprising iron DMAc complex embedded within polyimide matrix

Kundnani

Gupta

Arya

et al. 2009

Polymer Engineering & Sci

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Iron complexed with dimethylacetamide (DMAc) was incorporated in variable ultra low concentration in polyimide (PI) at it precursor stage to obtain nanoscopically manipulated metallopolyimide films. The in situ generation of these nanophase structures, their stability within PI matrix, and interaction with its chains was studied using UV-vis spectroscopy. AFM topographic image shows the presence of rock-shaped nano particles, which is produced by the formation of polyamic acid salt of Fe-DMAc complex. Unique fluorescence and improved hydrolytic stability of these metallopolyimide films were due to the formation of nanophase structures. Different photo-physical properties of developed films are attributed to size quantization effect. POLYM. ENG. SCI.,

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Section: Uv-vis Absorption Studies Of Metallopolyimide Filmssupporting

confidence: 85%

Study of fluorescent nanoparticle comprising iron DMAc complex embedded within polyimide matrix

Kundnani

Gupta

Arya

et al. 2009

Polymer Engineering & Sci

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“…Negative materials become insoluble (crosslinking reactions) under the action of UV light while positive photoresists act in the reverse manner. A review of the chemistry of photosensitive polyimides and related polymers was published by Ahne et al 41 with a special emphasis on commercially available polymers with respect to their applications in electronics.…”

Section: Soluble Photosensitive Polymersmentioning

confidence: 99%

Heterocyclic polymers with high glass transition temperatures

Sillion¹,

Rabilloud²

1995

New Methods of Polymer Synthesis

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Glass transition temperatures (Tgs) of polymers have been correlated with the concept of free volume so that the relationship between Tg and the molecular mass M (7.1) where T; is the glass transItIon temperature for infinite molecular weight, K is a constant and M is the molecular weight. This relation is understandable if one considers that the fractional free volume due to the chain ends decreases as the molecular weight increases. Assuming that molecular motion of a chain end is greater than for an internal part of the chain, a low molecular weight polymer will have a Tg lower than a corresponding high molecular weight polymer. The constant K is the contribution of the end-groups (7.2) where p is the polymer density, N A is Avogadro's number, e is the contribution of a chain end to the free volume and a[ is the thermal expansion coefficient of the free volume.A few long branches on a polymer backbone decrease Tg by increasing the number of chain ends, while regular short branching along the chain increases both the stiffness and Tg and decreases chain mobility. Crosslinking reduces the specific volume so that Tg rises as a consequence of the reduction in molecular motion. l For homo cyclic and heterocyclic aromatic polymers, structure-property relationships have been reviewed mainly for polyimides and some general features have been pointed out. In the case of aromatic substitution, meta-versus para-catenation decreases Tg and flexible bridging groups such as oxygen or methylene decrease Tg more than do highly dipolar groups such as carbonyl and sulfone. Bulky substituents or substituents which restrict free rotation between two phenyl rings also increase Tg• 2 ,3 Aromatic and heterocyclic high performance polymers are very often amorphous and the variation in properties is governed by Tg• J. R. Ebdon et al. (eds.), New Methods of Polymer Synthesis

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“…In recent years, PSPIs are widely used as protection and insulation layers in semiconductor manufacturing in the place of conventional polyimides because their use in the fabrication of microelectronic devices can reduce the number of processing steps required to obtain the desired photolithographic pattern 1–3…”

Section: Introductionmentioning

confidence: 99%

“…Most of them are prepared from poly(amic acid)s where crosslinking sites are introduced amic acids through ester and acid‐amine ion linkage 4, 5. However, the use of positive‐working PSPIs rather than negative‐working PSPIs is preferred in lithography because of many advantages such as lower sensitivity to dust particles, better suited shapes for the pattern profiles in multilayer systems, developability with alkaline aqueous solutions, and reduced impact on the environment 2, 3. There are many reports on the alkaline‐developable positive‐working PSPI, which are mainly prepared from polyimide precursor and dissolution inhibitor such as diazonaphtoquinone (DNQ) 6, 7.…”

Section: Introductionmentioning

confidence: 99%

A positive‐working photosensitive polyimide based on thermal cross‐linking and acidolytic cleavage

Jung

Hyeon-Lee

Choi

2007

J of Applied Polymer Sci

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A novel positive-working photosensitive polyimide (PSPI) based on a poly(hydroxyimide) (PHI), a crosslinking agent having vinyl ether groups, and a photoacid generator (PAG) was prepared. The PHI as a base resin of the three-component PSPI was synthesized from 4,4 0 -oxydiphthalic anhydride and 2,2 0 -bis(3-amino-4-hydroxyphenyl)hexafluoropropane through ring-opening polymerization and subsequent thermal cyclization. 2,2 0 -bis(4-(2-(vinyloxy)ethoxy)phenyl)propane (BPA-DEVE) was used as a vinylether compound and diphenyliodonium 5-hydroxynaphthalene-1-sulfonate was used as a PAG. The phenolic hydroxyl groups of the PHI and the vinyl ether groups of BPA-DEVE are thermally crosslinked with acetal structures during prebake step, and the crosslinked PHI becomes completely insoluble in an aqueous basic solution. Upon exposure to UV light (365 nm) and subsequent postexposure bake (PEB), a strong acid generated from the PAG cleaves the crosslinked structures, and the exposed area is effectively solubilized in the alkaline developer. The dissolution behavior of the PSPI containing each 11.5 wt % of BPA-DEVE and of the PAG was studied after UV exposure (365 nm) and PEB. It was found that the difference in dissolution rates between exposed and unexposed areas was enough to get high resolution. A fine positive pattern with a resolution of 5 lm in a 3.7-lm-thick film was obtained from the three-component PSPI.

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Recent advances in photosensitive polyimides

Cited by 32 publications

References 16 publications

Study of fluorescent nanoparticle comprising iron DMAc complex embedded within polyimide matrix

Study of fluorescent nanoparticle comprising iron DMAc complex embedded within polyimide matrix

Heterocyclic polymers with high glass transition temperatures

A positive‐working photosensitive polyimide based on thermal cross‐linking and acidolytic cleavage

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