Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2013
DOI: 10.1109/ipfa.2013.6599166
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Recent advances in fault isolation for semiconductor industry

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Cited by 5 publications
(4 citation statements)
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“…The semiconductor sector has witnessed various milestones and historical advancements. These advances have been fundamental to the continuous growth of the industry, paving the way for the creation of various products, from embedded devices to smartphones and computers (Chin et al, 2013;Lee, 2016). This segment has played an essential role in the current technological revolution.…”
Section: Perspectives and Advancesmentioning
confidence: 99%
“…The semiconductor sector has witnessed various milestones and historical advancements. These advances have been fundamental to the continuous growth of the industry, paving the way for the creation of various products, from embedded devices to smartphones and computers (Chin et al, 2013;Lee, 2016). This segment has played an essential role in the current technological revolution.…”
Section: Perspectives and Advancesmentioning
confidence: 99%
“…Estos avances han sido fundamentales para el crecimiento continuo de la industria, abriendo el camino para la creación de diversos productos, desde dispositivos integrados hasta teléfonos inteligentes y computadoras (Chin et al, 2013;Lee, 2016).…”
Section: Perspectivas Y Avancesunclassified
“…After chemical decapsulation was carried out, the bridging joints were observed. An open was suspected to be at a solder bump from fault isolation analysis through TDR [4]. In traditional FA process, physical cross-sectioning may be performed to confirm the failure location, it takes more time and possibly the defect may be missed.…”
Section: B X-ray Techniquementioning
confidence: 99%
“…(a) Broken via detected at the open failure bump with 3D X-ray image (b) cross-section image of un-landed via[4] …”
mentioning
confidence: 99%