Recent advances and applications of abrasive processes for microelectronics fabrications

Zhong, Zhang

doi:10.1108/mi-05-2019-0024

Cited by 6 publications

(3 citation statements)

References 73 publications

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“…The fabrication-based faults need to be taken care at the time of fabrication by incorporating different testing methods such as air-to-air thermal shock testing (Tian et al, 2020). Moreover, factors such as thermal stability issues (Peng and Yam, 2019), sub-surface damage and the strength of wafers need to be put under check for increasing the reliable fabrication (Zhong, 2019) of the dies. Otherwise, low reliability or electrical conductivity test failures can render the die useless (Nadaraja and Yap, 2019).…”

Section: Proposed Algorithmmentioning

confidence: 99%

Adaptive hybrid arbiter design for real-time traffic-aware scheduling

Khan

Mir

Din

2021

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Purpose This work focused on a basic building block of an allocation unit that carries out the critical job of deciding between the conflicting requests, i.e. an arbiter unit. The purpose of this work is to implement an improved hybrid arbiter while harnessing the basic advantages of a matrix arbiter. Design/methodology/approach The basic approach of the design methodology involves the extraction of traffic information from buffer signals of each port. As the traffic arrives in the buffer of respective ports, information from these buffers acts as a source of differentiation between the ports receiving low traffic rates and ports receiving high traffic rates. A logic circuit is devised that enables an arbiter to dynamically assign priorities to different ports based on the information from buffers. For implementation and verification of the proposed design, a two-stage approach was used. Stage I comprises comparing the proposed arbiter with other arbiters in the literature using Vivado integrated design environment platform. Stage II demonstrates the implementation of the proposed design in Cadence design environment for application-specific integrated chip level implementation. By using such a strategy, this study aims to have a special focus on the feasibility of the design for very large-scale integration implementation. Findings According to the simulation results, the proposed hybrid arbiter maintains the advantage of a basic matrix arbiter and also possesses the additional feature of fault-tolerant traffic awareness. These features for a hybrid arbiter are achieved with a 19% increase in throughput, a 1.5% decrease in delay and a 19% area increase in comparison to a conventional matrix arbiter. Originality/value This paper proposes a traffic-aware mechanism that increases the throughput of an arbiter unit with some area trade-off. The key feature of this hybrid arbiter is that it can assign priorities to the requesting ports based upon the real-time traffic requirements of each port. As a result of this, the arbiter is dynamically able to make arbitration decisions. Now because buffer information is valuable in winning the priority, the presence of a fault-tolerant policy ensures that none of the priority is assigned falsely to a requesting port. By this, wastage of arbitration cycles is avoided and an increase in throughput is also achieved.

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Section: Proposed Algorithmmentioning

confidence: 99%

Adaptive hybrid arbiter design for real-time traffic-aware scheduling

Khan

Mir

Din

2021

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“…They found that the larger the abrasive particle size, the higher the load, with larger loads causing greater damage to friction-pair surfaces. As we are currently witnessing rapid developments in precision mechanical equipment and high-end technology, the above discussion makes it apparent that it is very important to remove nano- and micron-level abrasive particles after the running-in stage in micromechanical systems to enhance lubrication performance. This is especially true when manufacturing integrated circuits − and in chemical mechanical polishing (CMP) processes, − during which some abrasive particles become embedded in the surface of the film layer, which makes them difficult to remove . Ng et al explored the effect of using surfactants on surface cleaning after CMP and found that surfactants can effectively reduce the number of residual large abrasive particles attached to the surface of the substrate.…”

Section: Introductionmentioning

confidence: 99%

Effects of Abrasive Particles on Liquid Superlubricity and Mechanisms for Their Removal

Wen

Bai

et al. 2021

Langmuir

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Liquid superlubricity results in a near-frictionless lubrication state, which can greatly reduce friction and wear under aqueous conditions. However, during the running-in process, a large number of abrasive particles are generated, and because these may lead to a breakdown in superlubricity performance, they should be effectively removed. In this paper, the morphology, size, and composition of abrasive particles were verified using scanning electron microscopy with energy-dispersive X-ray spectroscopy, and their influence on liquid superlubricity was explored through friction tests. Subsequently, different solvents were used to remove the abrasive particles, and the optimal cleaning process was determined by macroscopic tribo-tests and microscopic analysis. Finally, droplet-spreading experiments and a force-curve analysis were carried out to understand the abrasive-particle removal mechanism by different solvents. We found that SiO 2 was the main component in the abrasive particles, and micron-sized SiO 2 particles resulted in random "wave peaks" in the coefficient of friction and, thus, the superlubricity. Absolute ethanol + ultrapure water was determined to be the optimal solvent for effectively removing abrasive particles from friction-pair surfaces and helped the lubricant in exhibiting an ultralow friction coefficient for long periods of time. We proposed a "wedge" and "wrap" model to explain the abrasive-particle removal mechanism of different solvents. The SiO 2 removal mechanism outlined in this study can be applied under aqueous conditions to improve the stability and durability of liquid superlubricity in practical engineering applications.

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“…Stealth dicing [17][18][19] is another state-of-the-art dicing method where a pulsed laser, at a wavelength capable of penetrating the material, is focused inside the substrate. Focused laser spots cause an extremely high power density, both temporally and spatially, at localized points.…”

Section: Introductionmentioning

confidence: 99%

Dual Laser Beam Asynchronous Dicing of 4H-SiC Wafer

et al. 2021

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SiC wafers, due to their hardness and brittleness, suffer from a low feed rate and a high failure rate during the dicing process. In this study, a novel dual laser beam asynchronous dicing method (DBAD) is proposed to improve the cutting quality of SiC wafers, where a pulsed laser is firstly used to introduce several layers of micro-cracks inside the wafer, along the designed dicing line, then a continuous wave (CW) laser is used to generate thermal stress around cracks, and, finally, the wafer is separated. A finite-element (FE) model was applied to analyze the behavior of CW laser heating and the evolution of the thermal stress field. Through experiments, SiC samples, with a thickness of 200 μm, were cut and analyzed, and the effect of the changing of continuous laser power on the DBAD system was also studied. According to the simulation and experiment results, the effectiveness of the DBAD method is certified. There is no more edge breakage because of the absence of the mechanical breaking process compared with traditional stealth dicing. The novel method can be adapted to the cutting of hard-brittle materials. Specifically for materials thinner than 200 μm, the breaking process in the traditional SiC dicing process can be omitted. It is indicated that the dual laser beam asynchronous dicing method has a great engineering potential for future SiC wafer dicing applications.

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Recent advances and applications of abrasive processes for microelectronics fabrications

Cited by 6 publications

References 73 publications

Adaptive hybrid arbiter design for real-time traffic-aware scheduling

Adaptive hybrid arbiter design for real-time traffic-aware scheduling

Effects of Abrasive Particles on Liquid Superlubricity and Mechanisms for Their Removal

Dual Laser Beam Asynchronous Dicing of 4H-SiC Wafer

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