Abstract:Different from traditional static thermal solutions (STS) or dynamic thermal management (DTM), we propose a design of metallic thermal skeletons in order to conduct the heat generated by the virtual core array in this paper. Not only the proposed design can lower the maximum temperature of the hotspot, but improve the thermal uniformity of the test chip. Furthermore, the presented metallic thermal skeletons are composed of the BEOL metallization for connection with the on-chip heat sink. Virtual cores with tem… Show more
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